Preparation method of LED epitaxial wafer distributed Bragg reflector

A technology of LED epitaxial wafers and Bragg reflectors, which is applied in sputtering coating, ion implantation coating, coating, etc., can solve the problem of poor bonding between the first DBR layer and LED epitaxial wafers, and uneven refractive index of the first DBR layer. Meet the requirements and other issues, to achieve the effect of stable refractive index, not easy to fall off, strong adhesion

Inactive Publication Date: 2020-11-06
JUCAN PHOTOELECTRIC TECH (SUQIAN) CO LTD
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  • Application Information

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Problems solved by technology

However, if there are impurities on the quartz ring, the bonding force between the grown first DBR layer and the LED epitaxial wafer will be poor, and at the same time, the refractive index of the first DBR layer will not meet the requirements due to the presence of impurities.

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  • Preparation method of LED epitaxial wafer distributed Bragg reflector

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Embodiment Construction

[0028] The present invention will be described in detail below in conjunction with specific embodiments shown in the accompanying drawings. However, these embodiments do not limit the present invention, and any structural, method, or functional changes made by those skilled in the art according to these embodiments are included in the protection scope of the present invention.

[0029] One embodiment of the present invention provides a method for preparing a distributed Bragg reflector of an LED epitaxial wafer, by which a distributed Bragg reflector having a first DBR layer and a second DBR layer is formed on the back of the LED epitaxial wafer structure. In the present invention, the number of the first DBR layer and the number of the second DBR layer are at least one, and the number of the two is the same.

[0030] The methods include:

[0031] Rotate the quartz around its central axis by a first angle in a first direction, so that the electron beam sweeps the fan-shaped ...

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Abstract

The invention discloses a preparation method of an LED epitaxial wafer distributed Bragg reflector, and the method comprises the steps: enabling quartz to rotate around the central axis of the quartzat a first angle in a first direction, enabling an electron beam to sweep a quartz ring fan-shaped region corresponding to the first rotating angle, and carrying out the preprocessing of the fan-shaped region; rotating the quartz around the central axis of the quartz at a first angle in a second direction opposite to the first direction to enable the electron beam to sweep over the fan-shaped region again so as to grow a first DBR layer with a first refractive index on the back surface of the LED epitaxial wafer; and growing a second DBR layer with a second refractive index on the first DBR layer. Impurities on the surface of the quartz ring are removed through pretreatment, and it is ensured that the first DBR layer formed after growth is high in adhesion to the LED epitaxial wafer and not prone to falling off. The evaporation capacity of the quartz ring in the pretreatment process can be accurately controlled by adjusting the rotating speed and time of the quartz ring, so that the quartz ring is prevented from generating excessive waste.

Description

technical field [0001] The invention relates to an LED chip manufacturing process, in particular to a method for preparing a distributed Bragg reflector of an LED epitaxial wafer. Background technique [0002] LED (Light-Emitting Diode) is the abbreviation of light-emitting diode, which is a commonly used light-emitting device, which releases energy and emits light through the recombination of electrons and holes. As a new type of energy-saving and environmentally friendly solid-state lighting source, LED has the advantages of high energy efficiency, small size, light weight, fast response and long life, making it widely used in many fields. [0003] The back of the LED epitaxial wafer has a Distributed Bragg Reflector (Distributed Bragg Reflection, generally referred to as DBR), which has a periodically stacked superlattice layer, and a periodic structure composed of two materials with different refractive indices arranged alternately in an ABAB manner. . Silicon oxide is...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/46C23C14/02C23C14/08C23C14/10C23C14/30
CPCC23C14/022C23C14/083C23C14/10C23C14/30H01L33/46H01L2933/0025
Inventor 宋海飞贾杰
Owner JUCAN PHOTOELECTRIC TECH (SUQIAN) CO LTD
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