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Packaging structure and semiconductor device with same

A technology of packaging structure and packaging body, which is applied in the direction of semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc. question

Active Publication Date: 2020-10-30
JCET GROUP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the adapter board only plays the role of signal transfer and transmission, and does not improve the overall reliability, heat dissipation performance or electromagnetic shielding layer design flexibility of the packaging structure or semiconductor devices.

Method used

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  • Packaging structure and semiconductor device with same
  • Packaging structure and semiconductor device with same
  • Packaging structure and semiconductor device with same

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Embodiment Construction

[0025] The present invention will be described in detail below in conjunction with specific embodiments shown in the accompanying drawings. However, these embodiments do not limit the present invention, and any structural, method, or functional changes made by those skilled in the art according to these embodiments are included in the protection scope of the present invention.

[0026] In each drawing of the present application, some dimensions of structures or parts are exaggerated relative to other structures or parts for convenience of illustration, and therefore, are only used to illustrate the basic structure of the subject matter of the present application.

[0027] In addition, terms used herein such as "upper", "above", "under", "below", etc. to express relative positions in space are for convenience of description to describe a unit or feature as shown in the drawings relative to A relationship to another cell or feature. The terms of spatial relative position may be...

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Abstract

The invention discloses a packaging structure and a semiconductor device with the same. The packaging structure comprises a packaging body and an adapter plate, wherein the packaging body comprises apackaging body bonding pad, the adapter plate comprises a connecting bonding pad and a dummy bonding pad, the connecting bonding pad conducts the packaging body bonding pad, and the dummy bonding padis separated from the packaging body bonding pad. The adapter plate of the packaging structure not only comprises an area correspondingly connected with packaging body bonding pad, but also comprisesan extension area provided with the dummy bonding pad, and the dummy bonding pad at the extension area can be used for increasing the heat dissipation performance of the whole packaging structure, improving the reliability of the whole packaging structure, adjusting warping and the like.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a packaging structure and a semiconductor device having the same. Background technique [0002] With the continuous development of semiconductor technology, the function of a single chip is becoming more and more powerful. In actual operation, it is hoped that the size of the chip will become smaller and the number of I / Os per unit area will increase. In order to meet this demand, there have been Adapter board applications. [0003] At present, the adapter board only plays the role of signal transfer and transmission, and does not improve the overall reliability, heat dissipation performance or electromagnetic shielding layer design flexibility of the packaging structure or semiconductor devices. Contents of the invention [0004] An object of the present invention is to provide a package structure capable of improving overall reliability, heat dissipation, etc. of the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/488H01L23/367
CPCH01L23/488H01L23/367H01L2924/181H01L2224/16225H01L2924/19105H01L2924/00012
Inventor 陈建林耀剑史海涛刘硕周莎莎陈雪晴
Owner JCET GROUP CO LTD
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