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Heat dissipation device and heat dissipation system applying same

A technology of heat dissipation device and heat dissipation system, applied in cooling/ventilation/heating transformation, instruments, electrical and digital data processing, etc.

Pending Publication Date: 2020-10-27
WARECONN TECH SERVICE (TIANJIN) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, when the staff takes out or adds electronic equipment to the heat sink, the liquid level of the coolant will change
In this way, it will cause poor cooling effect

Method used

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  • Heat dissipation device and heat dissipation system applying same
  • Heat dissipation device and heat dissipation system applying same
  • Heat dissipation device and heat dissipation system applying same

Examples

Experimental program
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Embodiment Construction

[0033] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some of the embodiments of the present invention, but not all of them.

[0034] In order to make the object, technical solution and advantages of the present invention more clear, the heat dissipation device and the heat dissipation system using the heat dissipation device in the present invention will be further described in detail and related illustrations in conjunction with the accompanying drawings and embodiments.

[0035] Please refer to figure 1 , in a preferred embodiment of the present invention, a heat dissipation system 300 includes a heat dissipation device 100 and a plurality of electronic devices 200 . The heat dissipation device 100 is used for dissipating heat from the plurality of electronic devices 200 .

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PUM

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Abstract

The invention provides a heat dissipation system, which comprises a heat dissipation device and a plurality of electronic devices, wherein the heat dissipation device is used for heat dissipation of the plurality of electronic devices, and comprises a heat dissipation groove and a filling module, the heat dissipation groove is used for accommodating a cooling liquid and the plurality of electronicdevices, the plurality of electronic devices are immersed in the cooling liquid, the cooling liquid is used for heat dissipation of the plurality of electronic devices, and when the electronic deviceis taken out from the heat dissipation groove, the filling module is used for filling the same volume of the electronic device taken out from the heat dissipation groove, so that the heat dissipationeffect is good.

Description

technical field [0001] The invention relates to a heat dissipation device and a heat dissipation system using the heat dissipation device. Background technique [0002] With the rapid development of cloud computing technology, electronic devices such as servers are usually placed in heat sinks containing cooling liquid for centralized heat dissipation, so as to meet the heat dissipation requirements of electronic devices. [0003] However, when workers take out or add electronic equipment to the heat sink, the liquid level of the coolant will change. In this way, the heat dissipation effect will be poor. Contents of the invention [0004] In view of this, it is necessary to provide a heat dissipation device with a better heat dissipation effect and a heat dissipation system using the heat dissipation device. [0005] A heat dissipation device is used to dissipate heat for several electronic devices, the heat dissipation device includes a heat dissipation groove and a fil...

Claims

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Application Information

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IPC IPC(8): H05K7/20
CPCH05K7/20272H05K7/20236H05K7/20763G06F2200/201G06F1/20H05K7/20772H05K7/20263H05K7/20818
Inventor 毛之成傅彦钧张志鸿张耀廷魏钊科
Owner WARECONN TECH SERVICE (TIANJIN) CO LTD
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