Carbon cooling fin and preparation method thereof

A heat sink and carbon technology, applied in the field of carbon heat sink and its preparation, can solve the problems of low longitudinal thermal conductivity, no heat transfer, low bending resistance, etc., and achieve low cost, improved thermal conductivity, and uniform thickness Effect

Active Publication Date: 2020-10-23
江苏中商碳素研究院有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003]Although the overall thermal conductivity of carbon heat sink is low, its longitudinal thermal conductivity is very low, and its interface properties are relatively poor, so it cannot transfer heat well Come out, and there is still the deficiency of low bending resistance

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0026] The preparation method of the above-mentioned carbon heat sink comprises the following steps:

[0027] Preparation of S1 ionic liquid modified graphene layer;

[0028] Preparation of S2 conductive adhesive;

[0029] S3 Coat a layer of thermally conductive adhesive on the rough surface of the aluminum foil layer, then cover the ionic liquid-modified graphene layer and compound it on the rewinder.

[0030] The preparation method of the carbon heat sink has a simple preparation process, the thickness of the prepared carbon heat sink is uniform, and compared with the traditional single-layer graphene heat conduction film, the thermal conductivity is significantly improved.

[0031] Wherein, the preparation method of ionic liquid modified graphene layer is as follows:

[0032] S1 uniformly disperses the graphene in the mixed ionic liquid of (BMIM) PF6 and (MAIM) PF6 and stirs to form a casting solution, the graphene concentration of the casting solution is 0.15-0.18mg / ml; ...

Embodiment 1

[0036] A carbon heat sink, the heat sink includes a graphene layer and an aluminum foil layer, the graphene layer and the aluminum foil layer are connected by a thermally conductive adhesive, the graphene layer is an ionic liquid modified graphene layer, and the aluminum foil layer The contact surface with the thermally conductive adhesive is a rough surface, and the rough surface is composed of several frosted grains or several conical protrusions, the height of the several conical protrusions is 15 μm, and the mesh number of the several conical protrusions is 10 mesh. The thickness of the ink film vinyl layer is 30 μm, the thickness of the thermally conductive adhesive is 20 μm, and the thickness of the aluminum foil layer is 30 μm.

[0037] Among them, the composition of the thermally conductive adhesive is as follows: 30 parts of polyurethane prepolymer modified epoxy resin, 10 parts of epoxy resin matrix with epoxy groups at both ends of the molecular chain, 2 parts of imi...

Embodiment 2

[0048] A carbon heat sink, the heat sink includes a graphene layer and an aluminum foil layer, the graphene layer and the aluminum foil layer are connected by a thermally conductive adhesive, the graphene layer is an ionic liquid modified graphene layer, and the aluminum foil layer The contact surface with the thermally conductive adhesive is a rough surface, and the rough surface is composed of several frosted grains or several conical protrusions, the height of the several conical protrusions is 16 μm, and the mesh number of the several conical protrusions is 15 mesh. The thickness of the ink film vinyl layer is 30 μm, the thickness of the thermally conductive adhesive is 22 μm, and the thickness of the aluminum foil layer is 35 μm.

[0049] Among them, the composition by mass of the thermally conductive adhesive is as follows: 32 parts of polyurethane prepolymer modified epoxy resin, 15 parts of epoxy resin matrix with epoxy groups at both ends of the molecular chain, 3 part...

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Abstract

The invention relates to the technical field of semiconductor materials, and especially relates to a carbon cooling fin and a preparation method thereof. The cooling fin comprises a graphene film layer and an aluminum foil layer, the graphene film layer and the aluminum foil layer are connected through a heat conduction adhesive, the graphene film layer is an ionic liquid modified graphene film layer, and the contact surface of the aluminum foil layer and the heat conduction adhesive is a rough surface. An ionic liquid is adopted to modify a graphene layer to improve the longitudinal thermal conductivity of the graphene layer to a certain extent, and the overall heat dissipation efficiency of the carbon cooling fin is further improved in combination with the aluminum foil layer, so that the carbon cooling fin is suitable for more precise electronic products with higher heat dissipation requirements. Due to the structural design that the contact surface of the aluminum foil layer and the heat conduction adhesive is the rough surface and the rough surface is arranged on the aluminum foil layer, the contact area between the aluminum foil layer and the heat conduction adhesive is increased, and the bonding strength between the aluminum foil layer and the heat conduction adhesive is improved, so that the overall heat dissipation efficiency of the carbon cooling fin is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor materials, in particular to a carbon heat sink and a preparation method thereof. Background technique [0002] Carbon heat sinks are widely used in the heat dissipation of emerging ultra-thin electronic products such as notebook computers, flat panel displays, and LEDs. The heat dissipation performance is 2-3 times that of aluminum. The carbon heat sink is directly attached to the surface of the chip in the form of self-adhesive. The carbon heat sink can be tightly bonded to the attached object because of its soft texture. In addition, because of its high thermal conductivity, it can The heat can be quickly transferred to the metal shell and the heat dissipation profile, reducing the temperature of the heating point, so as to achieve a better heat dissipation effect. [0003] Although the overall thermal conductivity of the carbon heat sink is low, its longitudinal thermal conductivity is v...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20C01B32/194C09J163/00C09J11/04
CPCH05K7/20963C01B32/194C09J163/00C09J11/04C08K2201/014C08K2003/2227C08K2003/385C08L2205/025C08L63/00C08K3/22C08K3/38
Inventor 沈建林
Owner 江苏中商碳素研究院有限公司
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