A kind of organosilicon graphite composite thermal interface material and its preparation method and application

Abstract

The invention provides an organosilicon-graphite composite thermal interface material and its preparation method and application. The organosilicon-graphite composite thermal interface material comprises a graphite skeleton with a honeycomb structure and an organosilicon material filled in the honeycomb structure. The thermal interface material of the present invention includes organosilicon and honeycomb graphite skeleton, which not only retains the soft fit of organosilicon but also has good thermal conductivity of graphite skeleton, and the organosilicon material is filled in the honeycomb structure of graphite skeleton, making the present invention The thermal interface material has higher longitudinal thermal conductivity at a lower packing density, and the honeycomb structure can further improve the tensile strength of the silicone material and prolong the service life in harsh environments.

Description

technical field [0001] The invention belongs to the technical field of thermal interface materials, and relates to an organosilicon-graphite composite thermal interface material and a preparation method and application thereof. Background technique [0002] The fifth-generation mobile communication (5G) is a new generation of mobile communication system oriented to the needs of the information society in 2020. It has the characteristics of high spectrum utilization, large data flow, low network energy consumption, high reliability and short delay. , unmanned driving, telemedicine, artificial intelligence and other new-generation information technology application innovation foundation. The breakthrough of 5G communication technology and the expansion of application scenarios will promote the revolutionary development of smart terminals and bring new opportunities to the development of thermal interface materials industry. Especially with the continuous development of intell...

AI Technical Summary

Problems solved by technology

However, the organic silicon heat-conducting materials in the prior art are filled with high thermal conductivity ceramic particles in organic silicon, such as aluminum oxide, zinc oxide, quartz powder, aluminum nitride, boron nitride, silicon carbide, etc., which have low thermal conductivity ( Longitudinal thermal conductivity is difficult to exceed 8W·m -1 ·K -1 ), high density, high hardness, etc.

[0004] CN102746670A discloses a heat dissipation interface material used for packaging high-power LED lamps and a preparation method thereof. The heat dissipation interface material is made of a flexible AB two-component condensation type room temperature curing silicone resin as a matrix, added with dimethyl silicone oil and functionalized Graphene microflakes are fully mixed as thermal conductive fillers. During preparation, functionalized graphene microflakes and silicone resin are fully mixed on a double-roll mill, so that functionalized graphene is evenly dispersed in the silicone resin matrix, thereby preparing a performance Excellent heat dissipation interface material, although the interface contact thermal resistance is reduced, the thermal conductivity is still not high enough to meet the heat dissipation problems caused by the increase in power density brought about by the rapid development of the electronics industry

CN107686699A discloses a kind of heat conduction interface material and preparation method, and this heat conduction interface material comprises: graphene composite interface material gasket, spray resin, heat conduction insulation powder; The mixture of spray resin and heat conduction insulation powder, covers on graphene composite interface over the material spacer; it increases the insulation of the TIM, but its thermal conductivity is still low and too dense for the application