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An integrated circuit punching device with continuous operation

A technology of integrated circuit and drilling device, which is applied in metal processing and other directions, can solve the problems of inaccurate drilling position and inability to drill continuously, and achieve the effect of improving production efficiency

Active Publication Date: 2021-12-24
安徽浩瑞电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides an integrated circuit punching device capable of continuous operation, which has the advantages of continuous punching, precise punching position and working on holes of different diameters, and solves the problem of the existing integrated circuit board. During the process of drilling, the problems of continuous drilling, inaccurate drilling position and convenient replacement of drill bits for holes with different diameters

Method used

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  • An integrated circuit punching device with continuous operation
  • An integrated circuit punching device with continuous operation
  • An integrated circuit punching device with continuous operation

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Embodiment Construction

[0028] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0029] see Figure 1-8 , an integrated circuit punching device capable of continuous operation, comprising a punching box 1, the upper part of the punching box 1 is provided with a curved groove 101, and the upper part of the punching box 1 is provided with magnetic strips on both sides of the curved groove 101 Group 102, the bottom of the punching box 1 is provided with a rectangular groove 103, the inside of the punching box 1 and the curved groove 101 are p...

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Abstract

The invention relates to the technical field of integrated circuit processing and production, and discloses an integrated circuit punching device capable of continuous operation, including a punching box, the upper part of the punching box is provided with curved grooves, and the upper part of the punching box is provided with The magnetic strip group, the middle part of the rotating shaft is connected with a cylindrical magnet group, the lower end of the rotating shaft is fixedly connected with the first circular magnet, the inside of the fixed plate is connected with the first ring magnet, and the inner lower side of the drill seat is fixedly connected with the first circular magnet. The magnet corresponds to the second circular magnet, and the interior of the first circular magnet and the second circular magnet is provided with a corresponding combination of infrared devices. Through the interaction between the cylindrical magnet group and the magnetic strip group on the rotating shaft, the angle of the rotating shaft is guaranteed to change. Therefore, the angle of the guide groove set at the drilling point corresponds to the lower end of the rotating shaft. This structure achieves automatic and accurate drill bit replacement. effect, thereby solving the problem that the existing integrated circuit is inconvenient to replace the drill bit.

Description

technical field [0001] The invention relates to the technical field of integrated circuit processing and production, in particular to an integrated circuit punching device capable of continuous operation. Background technique [0002] Integrated circuits, or microcircuits, microchips, wafers, and chips, are a way of miniaturizing circuits in electronics, mainly including semiconductor devices, as well as passive components, and are often fabricated on the surface of semiconductor wafers. In recent years, integrated circuits have continued to develop towards smaller dimensions, allowing each chip to package more circuits. As the dimensions shrink, almost all indicators have improved-unit cost and switching power consumption have decreased, and speed has increased. But at the same time, the production and processing of integrated circuits has increased the precision requirements. [0003] In the production process of the integrated circuit board, it is necessary to punch more...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B26F1/16B26D7/01B26D7/26
CPCB26F1/16B26D7/01B26D7/2628B26F2210/08
Inventor 胡俊
Owner 安徽浩瑞电子科技有限公司
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