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Camera module, electronic equipment and vehicle with same

A technology for camera modules and electronic equipment, applied to parts of color TVs, parts of TV systems, TVs, etc., can solve problems such as temperature rise, energy consumption, and high temperature, and achieve reduced thickness, lower overall height, and improved The effect of cooling capacity

Pending Publication Date: 2020-10-16
NANCHANG O FILM OPTICAL ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the current development of self-driving car technology, Advanced Driver Assistance Systems (ADAS: Advanced Driver Assistance Systems) is also gradually popularized, and the demand for automotive lens modules is gradually growing. With the development of time, high resolution and high dynamics will also be the trend , with the improvement of performance, the image chip will consume more energy, which will also cause a substantial increase in its temperature. Due to the requirements of environmental reliability, such as high temperature and high humidity, automotive chips are usually implemented in the form of CSP. package, and then attached to the circuit board via surface mount technology (SMT: Surface Mount Technology) for use
The known manufacturing process in the past is due to the poor heat dissipation of the imaging chip package and the PCB board. After the performance of the imaging chip is improved, the temperature will be too high.

Method used

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  • Camera module, electronic equipment and vehicle with same
  • Camera module, electronic equipment and vehicle with same
  • Camera module, electronic equipment and vehicle with same

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0043] Refer below figure 1 and figure 2 The camera module 100a according to the first embodiment of the present invention will be described.

[0044] The camera module 100a according to the first embodiment of the present invention includes: a circuit board 10a, an image chip 20a, a first connecting portion 30a, and a cover plate 40a.

[0045] One side of the circuit board 10a has a receiving groove 11a. The image chip 20a is disposed in the receiving groove 11a, and the image chip 20a is electrically connected to the circuit board 10a through the electrical connection portion 21a. The first connecting portion 30a is connected between the image chip 20a and the inner wall of the receiving groove 11a, and the first connecting portion 30a covers the electrical connecting portion 21a. The cover plate 40a is arranged on the side of the image chip 20a away from the circuit board 10a, and the cover plate 40a is fixedly connected to the image chip 20a (or the cover plate 40a is ...

no. 2 example

[0056] The main difference between this embodiment and the first embodiment lies in: the shape of the top surface of the first connecting portion. In the first embodiment, the shape of the top surface of the first connecting portion 30a is flush with the top surface of the circuit board. In this embodiment, the shape of the surface of the first connecting portion 30b is inclined. The above-mentioned multiple embodiments are all applicable to this application, and details are not repeated here.

[0057] The camera module 100b according to the first embodiment of the present invention includes: a circuit board 10b, an image chip 20b, a first connecting portion 30b, and a cover plate 40b.

[0058]One side of the circuit board 10b has a receiving groove 11b. The image chip 20b is disposed in the receiving groove 11b, and the image chip 20b is electrically connected to the circuit board 10b through the electrical connection portion 21b. The first connecting portion 30b is connect...

no. 3 example

[0062] The main difference between this embodiment and the first embodiment and the second embodiment is that in the first two embodiments, the cover plate 40a

[0063] (or 40b) is fixedly connected with the image chip 20a (or 20b), or the cover plate is fixed with the image chip and the circuit board. In this embodiment, the cover plate 40c is only fixed with the circuit board 20c and has no direct contact with the image chip 20c. .

[0064] Refer below Figure 5 and Figure 6 The camera module 100c according to the third embodiment of the present invention will be described in detail.

[0065] The camera module 100c according to the third embodiment of the present invention includes: a circuit board 10c, an image chip 20c, a first connecting portion 30c, and a cover plate 40c.

[0066] One side of the circuit board 10c has a receiving groove 11c. The image chip 20c is disposed in the receiving groove 11c, and the image chip 20c is electrically connected to the circuit bo...

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Abstract

The invention discloses a camera module, electronic equipment and a vehicle with the same. The camera module comprises a circuit board, an image chip, a first connecting part and a cover plate, and anaccommodating groove is formed in one side of the circuit board; the image chip is arranged in the accommodating groove and is electrically connected with the circuit board through the electric connecting part; the first connecting part is connected between the image chip and the inner wall of the accommodating groove, and the first connecting part covers at least part of the electric connectingpart; the cover plate is arranged on the side, away from the circuit board, of the image chip, and the cover plate is fixedly connected with at least one of the circuit board and the image chip so that the image chip can be sealed in the accommodating groove. According to the camera module, the image chip is arranged in the circuit board in an embedded or embedded mode, and the image chip is packaged through the first connecting part and the cover plate, so that the image chip is protected against the influence of external moisture and dirt, the heat dissipation capacity of the camera module is improved, and the total height of the camera module is reduced.

Description

technical field [0001] The invention relates to the field of optical modules, in particular to a camera module, electronic equipment and a vehicle with the same. Background technique [0002] With the current development of self-driving car technology, Advanced Driver Assistance Systems (ADAS: Advanced Driver Assistance Systems) is also gradually popularized, and the demand for automotive lens modules is gradually growing. With the development of time, high resolution and high dynamics will also be the trend , with the improvement of performance, the image chip will consume more energy, which will also cause a substantial increase in its temperature. Due to the requirements of environmental reliability, such as high temperature and high humidity, automotive chips are usually implemented in the form of CSP. package, and then attached to the circuit board via surface mount technology (SMT: Surface Mount Technology). The known process in the past is due to the poor heat dissip...

Claims

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Application Information

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IPC IPC(8): H04N5/225G03B17/55
CPCG03B17/55H04N23/50H04N23/57H04N23/54
Inventor 黄振棠
Owner NANCHANG O FILM OPTICAL ELECTRONICS TECH CO LTD
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