Encryption eMCP chip structure and data processing method

Abstract

The invention discloses an encryption type eMCP chip structure, which is packaged with an eMMC unit, an NAND Flash unit and an encryption chip, the eMMC unit is used for receiving data transmitted byan upper computer; the encryption chip is used for carrying out encryption processing on the data received by the eMMC unit; and the NAND Flash unit is used for storing the data encrypted by the encryption chip. The implementation of the method is based on the eMCP, the whole eMCP chip is controlled through the encryption chip, and then the encryption chip and the eMCP are repackaged together to form an encrypted eMCP chip, so that the encryption function is realized, and the confidential information of the eMCP cannot be read on the premise that a user does not have a key. Compared with the prior art, the technical problem of capacity of the eMCP chip is solved, the eMMC5.1 and the LPDDR are matched at the same time, and the capacity is continuously increased along with the development ofthe eMMC5.1 technology, so that the chip can operate more reliably and stably.

Description

technical field [0001] The invention relates to an eMCP chip, in particular to an encrypted eMCP chip structure and a data processing method. Background technique [0002] With the rapid progress of the information age, information confidentiality measures are particularly important. Leakage incidents will occur if you are not careful, which will cause serious adverse consequences for individuals and companies. Therefore, the emergence of encrypted eMCP is especially important. [0003] In the prior art, combined with figure 1 and figure 2 As shown, the embedded multi-layer packaging chip (eMCP, Embedded Multi-Chip Package) on the market itself has no encryption function, and the eMCP on the market needs to cache (LPDDR, Low Power Double Data Rate SDRAM) and embedded storage Chips (eMMC, Embedded MultiMedia Card) are assembled together, and it is difficult to increase the capacity. In addition, most of the current eMCPs are used in smart phones, and the internal structur...

AI Technical Summary

Problems solved by technology

[0003] In the prior art, combined with figure 1 and figure 2 As shown, the embedded multi-layer packaging chip (eMCP, Embedded Multi-Chip Package) on the market itself has no encryption function, and the eMCP on the market needs to cache (LPDDR, Low Power Double Data Rate SDRAM) and embedded storage Chips (eMMC, Embedded MultiMedia Card) are assembled together, and capacity growth is more difficult

In addition, most of the current eMCPs are used in smart phones, and the internal structure cannot be optimized in the process of mass production, which can easily lead to the problem that LPDDR and eMMC are more prone to signal interference, which will lead to quality problems

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