Gluing equipment for use in pin lead production of electron components

Abstract

The invention discloses gluing equipment for use in pin lead production of electron components, and relates to the technical field of electrical accessories. The gluing equipment comprises a storage box, wherein a mounting groove is formed inside the side wall of the storage box along the circumferential direction of the storage box; heater strips are arranged inside the mounting groove; an uppercover is arranged on the top of the storage box; a cylinder is arranged above the upper cover; a glue outlet hole is formed inside the bottom end of the storage box; a rubber column is arranged insidethe glue outlet hole in an interference fit way; and the bottom of the storage box is in threaded connection with a gluing head. Through adoption of the gluing equipment, gluing is realized through upward and downward movement of the rubber column. In addition, the heater strips can be used for heating glue inside the storage box, so that the problems that a dispensing valve on gluing equipment is relatively complex in structure and relatively high in cost in the prior art and that the gluing quality is influenced due to unsmooth glue discharging during gluing under a low temperature environment since glue used in pin lead production is relatively poor in fluidity in the prior art are solved.

Description

technical field [0001] The invention belongs to the technical field of electrical accessories, in particular to a glue coating equipment for the production of pin leads of electronic components. Background technique [0002] The pin lead is also called the pin, which is the connection between the internal circuit of the integrated circuit and the peripheral circuit. All the pins constitute the interface of the chip, and a section at the end of the lead is connected to the printed board by soldering. The solder pads on the surface together form solder joints, and pin leads are used in most electronic components. At present, the pin leads need to be dispensed with glue during production, but the glue coating equipment in the prior art mainly relies on dots. The glue valve is used to apply glue, but the structure of the glue dispensing valve is relatively complicated, and the cost is high, and the fluidity of the glue used in the production of pin leads in the prior art is poor...

AI Technical Summary

Problems solved by technology

[0003] The object of the present invention is to provide a kind of glue application equipment for the production of electronic component pin leads, which realizes glue application through the up and down movement of the rubber column, and can heat the glue inside the storage box through the heating wire, which solves the problems of the prior art. The structure of the dispensing valve on the gluing equipment is relatively complicated, and the cost is high at the same time, and the fluidity of the glue used in the production of pin leads in the prior art is poor. Smooth, problems that affect the quality of gluing

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