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Adhesive tape with handle die cutting material-saving equipment and processing technology thereof

A processing technology and adhesive tape technology, which is applied in the field of adhesive tape plus handle die-cutting material-saving equipment and its processing technology, can solve the problems of labor waste, difficult to quickly remove the tape release layer, etc., to reduce the cost of materials and labor of enterprises Strength, work efficiency improvement effect

Pending Publication Date: 2020-09-22
隆扬电子(昆山)股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With the thinning and lightening of electronic products, various parts are becoming more and more refined, and the size of the tape is also narrower and smaller. In actual assembly, it is difficult to quickly remove the release layer on the tape, resulting in labor waste.

Method used

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  • Adhesive tape with handle die cutting material-saving equipment and processing technology thereof
  • Adhesive tape with handle die cutting material-saving equipment and processing technology thereof
  • Adhesive tape with handle die cutting material-saving equipment and processing technology thereof

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Embodiment Construction

[0022] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.

[0023] see Figure 1 to Figure 3 , a tape and handle die-cutting material-saving equipment and its processing technology, including a frame 1 and a base 8; the frame 1 is sequentially provided with a conveying film A2, a conveying film B3 and a conveying film C4 from top to bottom, and the The base 8 is provided with a transmission frame 7, the transmission frame 7 includes a rubber roller 71, a rubber roller 2 72 and a rubber roller 3 73, and the transmission frame 7 transmits the transmission film A2 and the transmission film B3 to the bottom of the die-cutting mechanism 5 , the conveying film A2 is located between the first rubber roller 71 and the second rubber r...

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Abstract

The invention discloses adhesive tape with handle die cutting material-saving equipment and a processing technology thereof. The adhesive tape with handle die cutting material-saving equipment comprises a frame and a base, wherein a conveying film A, a conveying film B and a conveying film C are sequentially arranged from top to bottom on the frame; a conveying frame is arranged on the base; the conveying frame comprises a rubber roller I, a rubber roller II and a rubber roller III; the conveying frame conveys the conveying film A and the conveying film B to the lower side of a die cutting mechanism; the conveying film A is positioned between the rubber roller I and the rubber roller II; the conveying film B is positioned between the rubber roller II and the rubber roller III; a pressing plate is arranged on the base; the conveying film C is positioned below the pressing plate, and moves along the upper surface of the base; and a collecting roller is arranged on the side, far away fromthe conveying frame, of the base. According to the adhesive tape with handle die cutting material-saving equipment, jumping-distance punching and composition are performed on an adhesive tape througha specific program, so that no waste is produced between product distances, and the enterprise material cost is lowered. A handle is arranged on the surface of the adhesive tape, so that a release layer can be removed easily, and the working efficiency is improved effectively.

Description

technical field [0001] The invention relates to the field of die-cutting technology, in particular to a material-saving die-cutting equipment with tape and handle and a processing technology thereof. Background technique [0002] Adhesive tapes are used in a wide range of applications, such as bonding of heat dissipation materials, bonding of optically transparent materials and flexible materials, and structural bonding of buttons and components, providing reliable solutions for the interior and exterior of electronic devices. With the thinning and lightening of electronic products, various components are becoming more and more refined, and the size of the tape is also narrower and smaller. In actual assembly, it is difficult to quickly remove the release layer on the tape, resulting in labor waste. Contents of the invention [0003] Purpose of the invention: In order to solve the deficiencies in the background technology, the present invention discloses a material-saving ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B26F1/38B26D5/00B26D7/27C09J7/40
CPCB26D5/00B26D7/27B26F1/38C09J7/403
Inventor 张东琴陈先锋衡先梅
Owner 隆扬电子(昆山)股份有限公司
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