Display substrate, display device and packaging method thereof

Abstract

The invention discloses a display substrate which is provided with a substrate body and a plurality of light-emitting devices arranged on the substrate body and further comprises a discontinuous organic layer and a packaging layer. The discontinuous organic layer is arranged around the edges of the light-emitting devices and exposes the light-emitting devices and part of the substrate body. The packaging layer is provided with a first inorganic layer, and the first inorganic layer is arranged on the discontinuous organic layer and covers the exposed light-emitting device, the exposed part of the substrate and the discontinuous organic layer.

Description

technical field [0001] The present application relates to the field of organic electroluminescent device displays, and in particular, to a display substrate, a display device and a packaging method thereof. Background technique [0002] Organic electroluminescent displays (OLEDs) are widely studied and applied because of their advantages of self-luminescence, fast response speed, high contrast, thinness, low power consumption, and wide viewing angle. [0003] In the OLED display structure, the thin-film encapsulation process is a key factor in realizing flexible products, and the quality of the encapsulation effect directly affects the service life of the flexible products. Especially for bendable products, the stability of thin-film encapsulation is crucial. see 1A to 1D , Figure 1A It is a schematic structural diagram of a display device in the prior art; Figure 1B for Figure 1A Schematic diagram of the structure of the display device after bending; Figure 1C A s...

AI Technical Summary

Problems solved by technology

Such as , the existing display device includes a substrate 100, a plurality of light-emitting devices 200 arranged on the substrate 100, and a plurality of organic light-emitting devices 200 arranged on and covering The encapsulation layer 300 of the plurality of organic light-emitting devices 200, in order to realize flexible display, the typical encapsulation layer 300 currently used is a laminated structure of the first inorganic layer 101 / organic layer 102 / second inorganic layer 103, but for To ensure good water and oxygen barrier performance, the thicknesses of the first inorganic layer 101 and the second inorganic layer 103 are both about 1 μm, which reduces the life of the bent product, and in order to cover the surface of the first inorganic layer 101 may Existing impurity particles (particles), the thickness of the organic layer 102 is about 12 μm, resulting in a large flexible bending radius, and the organic layer 102 may be broken at the steps of the light emitting device 200 to generate cracks 1011

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