Transient high-temperature field heat flux measuring device and method based on memory alloy

Abstract

The invention discloses a transient high-temperature field heat flux measuring device and method based on memory alloy, and aims to solve the defects that an existing measuring method is greatly influenced by the emissivity of a measured object, the response speed is insufficient and the like. The measuring device is composed of a packaging shell, a thermosensitive element, a memory alloy component, a sliding block, a fixed base, a movable bolt and a screw. The packaging shell, the thermosensitive element, the memory alloy component, the sliding block and the fixed base are coaxially installed. The temperature of the thermosensitive element rises under the action of heat carried by a transient temperature high-temperature field, the heat is transmitted to the memory alloy component, and the memory alloy component shrinks under heating to drive the sliding block to move. After the transient high-temperature field is loaded, the axial shortening amount of the memory alloy component is obtained according to the displacement of the sliding block, and in combination with the loading time, passive quantitative measurement of the heat flux of the transient high-temperature field can be achieved. The device is simple in structure, does not need power supply, is convenient to lay and low in cost, can be repeatedly used, and is high in response sensitivity for transient high-temperaturefields with different intensities.

Description

technical field [0001] The invention belongs to the field of measurement and detection, and specifically relates to a method and device for measuring transient high-temperature field heat flux, which is a method and a device for measuring transient high-temperature field heat flux by utilizing the plastic deformation characteristic of memory alloy heated. Background technique [0002] At present, with the development of science and technology, transient high-temperature fields are often formed in some application scenarios (transient high-temperature fields refer to high-temperature fields that exist for seconds or even milliseconds), such as explosive explosions, gas explosions, mine blasting, Under these circumstances, measuring the heat flux of the resulting transient high-temperature field is of great significance for practical applications, so related research on the measurement of heat flux in the transient high-temperature field has increasingly become a research hotsp...

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Problems solved by technology

[0011] The technical problem to be solved by the present invention is to provide a transient high-temperature field heat flux passive measurement device and method based on the plastic deformation of the one-way memory alloy, which solves the problem that the existing non-contact temperature measurement method is less affected by the emissivity of the measured object. Large, easily affected by other factors, the measured temperature is the surface temperature of the object, and the surrounding medium is easy to cause measurement errors; make up for the lack of response speed of the existing contact temperature measurement method, and the interference of the measured high-temperature field caused by contact with the measured object shortcoming

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