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Thermally conductive sheet precursor, thermally conductive sheet obtained from precursor and production method thereof

A technology of thermal conductive sheet and precursor, applied in semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc., can solve problems such as performance degradation and damage

Inactive Publication Date: 2020-08-14
3M INNOVATIVE PROPERTIES CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Heat-generating components such as semiconductor elements may easily cause performance degradation and damage due to heat during use

Method used

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  • Thermally conductive sheet precursor, thermally conductive sheet obtained from precursor and production method thereof
  • Thermally conductive sheet precursor, thermally conductive sheet obtained from precursor and production method thereof
  • Thermally conductive sheet precursor, thermally conductive sheet obtained from precursor and production method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1 to 9 and comparative example 1 to 5

[0084] Although specific embodiments of the present disclosure will be illustrated in the following examples, the present disclosure is not limited to these examples.

[0085] The products etc. used in these Examples are shown in Table 1 below.

[0086] [Table 1]

[0087]

[0088]

[0089] The materials shown in Table 1 were mixed according to the ratio shown in Table 2 to make a corresponding coating solution for making the thermal conductive sheet precursor. Here, all numerical values ​​in Table 2 refer to parts by mass.

[0090]

[0091]

[0092] assessment test

[0093] The characteristics and internal structure of the heat transfer sheet were evaluated using the following methods.

[0094] Thermal conductivity test

[0095] The thermal diffusivity was measured as follows using the flash analysis method of Hyperflash (trade name) LFA467 manufactured by Netzsch. Place the thermal conductive sheet precursor between two release films, and put it into a ...

Embodiment 1

[0102]Immediately after preparing a coating solution TA-3 containing A100 and P003 (85 / 15 in ratio) for the thermal conductive sheet precursor, a layer of 38 μm thick PET release film was applied using a knife coater with a gap interval of 290 μm (A31: available from Du Pont-Toray Co., Ltd.), followed by drying at 65° C. for 5 minutes. The samples were further dried at 100° C. for 5 minutes to make each thermal conductive sheet precursor with a thickness of about 180 μm to apply various levels of pressure. Next, for each thermal conductive sheet precursor, two thermal conductive sheet precursors were laminated, respectively applying pressures of 1 MPa, 2 MPa, 3 MPa, and 10 MPa at 65° C. for 5 minutes to produce thermal conductive sheets. The results concerning the relative thickness of the thermal pad obtained, i.e. the ratio between the thermal pad thickness and the thickness of the thermal pad precursor and the dielectric breakdown voltage as Figure 4 shown. Here, an embo...

Embodiment 2

[0104] Thermal pads were fabricated in the same manner as in Example 1, except that instead of TA, the coating solution TA-5 containing A100 and P003 (60 / 40 ratio) for the thermal pad precursor was used here -3. The results about the relative thickness of the heat conducting sheet and the dielectric breakdown voltage are as follows: Figure 4 shown. Embodiments to which pressures of 1 MPa and 2 MPa were applied were also used here as reference examples.

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Abstract

The present invention aim to provide a thermally conductive sheet precursor exhibiting excellent thermal conductivity and dielectric breakdown resistance, a thermally conductive sheet obtained from the precursor, and a production method thereof. The thermally conductive sheet precursor according to an embodiment of the present disclosure includes isotropic thermally conductive aggregates in whichanisotropic thermally conductive primary particles are aggregated, an anisotropic thermally conductive material not constituted by the aggregates, and a binder resin, wherein upon the application of apressure from 3 to 12 MPa to the thermally conductive sheet precursor, at least some of the isotropic thermally conductive aggregates collapse.

Description

technical field [0001] The present invention relates to a thermally conductive sheet precursor exhibiting excellent thermal conductivity and dielectric breakdown resistance, a thermally conductive sheet obtained from the precursor, and a method of making them. Background technique [0002] Heat-generating components such as semiconductor elements may easily cause performance degradation and damage due to heat during use. In order to eliminate such problems, sheets having thermal conductivity are used, for example, in the assembly of power modules of electric vehicles (EVs) in which semiconductor heat sinks are mounted on heat sinks. [0003] Patent Document 1 (JP 5036696 B) describes a thermally conductive sheet prepared by dispersing secondary aggregated particles, wherein primary particles of flake boron nitride are isotropically aggregated in a thermosetting resin, wherein the secondary aggregated particles are Spherical, the average particle size is not less than 20 μm ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/373C08L101/00H05K7/20
CPCH01L23/3737C08J5/18C08J2363/00C08K3/38C08K5/04C08K5/3155C08K2003/2227C08K2003/385C08K2201/001C08L63/04
Inventor 里卡多·沟口·戈里戈尔
Owner 3M INNOVATIVE PROPERTIES CO
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