Heat dissipation type electronic computing device for office space

Abstract

The invention relates to a heat dissipation type electronic computing device for an office space. The heat dissipation type electronic computing device includes a shell and a switch, and the shell isin a cuboid shape. The switch is arranged on one side of the shell; a heat dissipation mechanism and a cleaning mechanism are arranged on the shell; the cleaning mechanism is located at the top of theshell. The heat dissipation mechanism is located on the side, away from the switch, of the shell. The heat dissipation mechanism comprises a water tank, an extrusion disc, a mounting plate, a fixed pipe, a connecting pipe, a moving pipe, a sealing block and a pushing assembly; the cleaning mechanism comprises a transmission assembly, a connecting bearing, a rotating shaft, a scraping rod, a connecting ring and two magnet blocks. According to the heat dissipation type electronic computing equipment for the office space, the heat dissipation function is achieved through the heat dissipation mechanism, and in addition, the dust removal function is achieved through the cleaning mechanism.

Description

technical field [0001] The invention relates to the field of computers, in particular to a heat-dissipating electronic computing device used in offices. Background technique [0002] Computer, commonly known as computer, is a modern electronic computing machine used for high-speed computing. It can perform numerical calculations, logic calculations, and storage and memory functions. As a part of computer accessories, the main function of the chassis is to place and fix each computer. Accessories, play a supporting and protective role, in addition, the computer case has an important role in the shielding of electromagnetic radiation. [0003] During the use of the existing chassis, in order to prevent the circuit board inside the chassis from being damaged due to overheating, most of them use air flow to dissipate heat, and, in order to prevent dust, filter screens are installed on the cooling holes, but long-term use Finally, more dust will be generated on the filter screen...

AI Technical Summary

Problems solved by technology

[0003] During the use of the existing chassis, in order to prevent the circuit board inside the chassis from being damaged due to overheating, most of them use air flow to dissipate heat, and, in order to prevent dust, filter screens are installed on the cooling holes, but long-term use Finally, more dust will be generated on the filter screen, which will block the filter screen, affect the flow of air, and reduce the heat dissipation effect. Not only that, more dust is easy to accumulate on the top of the chassis, which not only affects the cleanliness, but also affects the heat dissipation effect

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