Housing components and electronics
A shell assembly and shell technology, applied in the electronic field, can solve problems such as high temperature, affecting the shooting performance of the camera, affecting the performance of the surrounding shell of the camera, etc., and achieve the effect of avoiding local high temperature
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loaded, and will not be repeated here. The electronic device 1000 according to the embodiment of the present application is provided between the rear case 112 and the first graphite sheet 121
The foam 134, on the one hand, utilizes the heat insulating holes 131 on the foam 134 to insulate heat from being transmitted to the casing 110 in the vertical direction
This can prevent the outer surface temperature of the casing 110 from being too high; on the other hand, the foam 134 is disposed between the camera module and the rear casing 112
In the meantime, the foam 134 can provide buffer protection for the camera module to prevent the camera module from being damaged under the action of external force.
At the same time, the insulating holes 131 are formed on the foam 134 , compared with the solution of opening the insulating holes 131 on the platen support 133 , there is no problem.
The structural strength of the platen bracket 133 is reduced.
[0065] In the above-mentioned...
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