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Explosion-proof PCB

A kind of PCB board, explosion-proof technology, applied in printed circuit components, circuit thermal devices, printed circuit stress/deformation reduction and other directions, can solve problems such as damage and explosion of PCB boards, prolong service life, reduce production costs, and prevent deformation. Effect

Inactive Publication Date: 2020-07-10
万安裕维电子股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to overcome the deficiencies in the prior art and provide an explosion-proof PCB board, which can effectively prevent problems such as damage and bursting of the PCB board caused by the processing of the installation groove.

Method used

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  • Explosion-proof PCB
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] The embodiment of the invention discloses an explosion-proof PCB board,

[0027] Specifically include:

[0028] see figure 1 , figure 2 , an explosion-proof PCB board, including a top board 1, a wire layer 2, a signal layer 3 and a bottom board 4 connected in sequence, the top board 1, the wire layer 2, the signal layer 3 and the bottom board 4 have the same structure, each The layers are bonded with an insulating bonding material, and the top layer board 1 is a PCB substrate 10;

[0029] The PCB substrate 10 includes a mounting hole 101, a circuit connection pad 102, an oval mounting area 103, a circular mounting area 104, a rectangular mounting area 105 and an explosion-proof hole 106;

[0030] The bottom of the bottom plate 4 is provided with a layer of natural graphite heat dissipation film.

[0031] The explosion-proof PCB board is formed by laminating a top layer board 1 , a wire layer 2 , a signal layer 3 and a bottom board 4 .

[0032] The PCB substrate 10...

Embodiment 2

[0043] The embodiment of the invention discloses an explosion-proof PCB board,

[0044] Specifically include:

[0045] see figure 1 , figure 2 , an explosion-proof PCB board, including a top board 1, a wire layer 2, a signal layer 3 and a bottom board 4 connected in sequence, the top board 1, the wire layer 2, the signal layer 3 and the bottom board 4 have the same structure, each The layers are bonded with an insulating bonding material, and the top layer board 1 is a PCB substrate 10;

[0046] The PCB substrate 10 includes a mounting hole 101, a circuit connection pad 102, an oval mounting area 103, a circular mounting area 104, a rectangular mounting area 105 and an explosion-proof hole 106;

[0047] The bottom of the bottom plate 4 is provided with a layer of artificial graphite heat dissipation film.

[0048] The explosion-proof PCB board is formed by laminating a top layer board 1 , a wire layer 2 , a signal layer 3 and a bottom board 4 .

[0049] The PCB substrate...

Embodiment 3

[0060] The embodiment of the invention discloses an explosion-proof PCB board,

[0061] Specifically include:

[0062] see figure 1 , figure 2 , an explosion-proof PCB board, including a top board 1, a wire layer 2, a signal layer 3 and a bottom board 4 connected in sequence, the top board 1, the wire layer 2, the signal layer 3 and the bottom board 4 have the same structure, each The layers are bonded with an insulating bonding material, and the top layer board 1 is a PCB substrate 10;

[0063] The PCB substrate 10 includes a mounting hole 101, a circuit connection pad 102, an oval mounting area 103, a circular mounting area 104, a rectangular mounting area 105 and an explosion-proof hole 106;

[0064] A layer of nano-carbon heat dissipation film is provided on the bottom of the bottom plate 4 .

[0065] The explosion-proof PCB board is formed by laminating a top layer board 1 , a wire layer 2 , a signal layer 3 and a bottom board 4 .

[0066] The PCB substrate 10 is pr...

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Abstract

The invention discloses an explosion-proof PCB, which comprises a top layer board, a wire layer, a signal layer and a bottom layer board which are connected in sequence, all the layers have the same structure and are bonded by adopting an insulating bonding material, and the top layer board is a PCB substrate; the PCB substrate comprises an installation hole, a circuit connection bonding pad, an oval installation area, a circular installation area, a rectangular installation area and explosion-proof holes. And a layer of heat dissipation film is arranged at the bottom of the bottom layer plate. The explosion-proof PCB has the beneficial effects that the plurality of explosion-proof holes are formed in the installation area, so that the pressure of a stamping edge can be dispersed, the stress concentration is avoided, the burst damage of the PCB caused by the stress concentration is prevented, the qualification rate of the PCB is improved, and meanwhile, the production cost of the PCB is reduced; the heat dissipation film is arranged at the bottom of the bottom layer plate, heat can be dissipated in time in the working process, the anti-explosion holes are funnel type anti-explosionholes, pressure can be rapidly relieved, deformation is effectively prevented, and the service life is prolonged.

Description

technical field [0001] The invention relates to a PCB board, in particular to an explosion-proof PCB board. Background technique [0002] Printed circuit board {PCB circuit board}, also known as printed circuit board, is the provider of electrical connections for electronic components. The main advantage of using circuit boards is to greatly reduce the errors of wiring and assembly, and improve the level of automation and production labor rate. According to the number of layers of circuit boards, it can be divided into single-sided boards, double-sided boards, four-layer boards, six-layer boards and other multi-layer circuit boards. Generally, a PCB board includes a substrate and a printed circuit. Electronic components generally need to be installed on the printed circuit. In order to facilitate the installation of electronic components, an installation area is set on the substrate, and then the installation area is stamped by stamping and other processes to form the insta...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02
CPCH05K1/0209H05K1/0271
Inventor 谢顺满
Owner 万安裕维电子股份有限公司
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