High-precision chip welding method of LED full-automatic die bonder

Abstract

The invention relates to a high-precision chip welding method of an LED full-automatic die bonder. By improving the die bonding support and the support clamp, the loading process of the die bonding support is greatly improved. Rapid loading by workers is facilitated; meanwhile, a worker can conveniently take out the die bonding support from the support clamp; the support clamp can rapidly completefixation removal through the arrangement of the compression spring. A worker can conveniently take out the die bonding support from the support clamp; the T-shaped sliding groove can be effectively protected through the dustproof belt arranged at the groove opening of the T-shaped sliding groove; the influence of external impurities in the T-shaped sliding groove is not easy to occur; normal sliding of the sliding block and the connecting column is not easily influenced; and finally, for the support clamp, through the design that one of the connecting base and the connecting rod is hard and the other is soft, on the premise that the relative stability of the support main rod and the support bowl cup is guaranteed, the upper portion of the support main rod and the support bowl cup can conduct small-amplitude displacement within a controllable range, and the support clamp can be conveniently matched with reinforcing work of the die bonding support.

Description

technical field [0001] The invention relates to a high-precision chip welding method of an LED full-automatic crystal-bonding machine, in particular to a high-precision chip-welding method of an LED full-automatic crystal-bonding machine. Background technique [0002] Solid crystal is also known as Die Bond or chip loading. Die-bonding is the process of bonding the chip to the designated area of ​​the bracket through colloid (for LEDs, generally conductive glue or insulating glue), forming a thermal path or an electrical path, and providing conditions for subsequent wiring connections. The main working process of the machine is dispensing glue on the bottom frame (1), dotting the crystal-bonding glue inside the cup, loading the film into the T-shaped chute (2), putting the LED chip inside the dispensing cup, and the slider ( 3) Baking, put the solid crystal lamp cup in the oven and bake three steps, and the above three steps have been greatly automated. Under the control of...

AI Technical Summary

Problems solved by technology

[0004] Before using the crystal bonder for crystal bonding work, it is usually necessary for technicians to prepare in advance, including melting the adhesive and fitting the crystal bonding bracket equipment to the bracket fixture and installing the bracket fixture to the designated position of the crystal bonder. Fixed, waiting for the follow-up die-bonding work, once there is an error in the manual assembly of the die-bonding bracket, it will easily affect the accuracy of the subsequent die-bonding work and affect the normal die-bonding work

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