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Flexible array substrate, preparation method thereof and flexible display panel

A flexible array and substrate technology, applied in the direction of identification devices, instruments, semiconductor devices, etc., can solve the problems of stress and concentration that are easy to form long grooves

Pending Publication Date: 2020-06-26
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention at least partially solves the problem of stress concentration caused by easy formation of elongated grooves due to over-engraving in the existing flexible array substrate during the preparation process, and provides a method for avoiding stress concentration caused by easy formation of elongated grooves due to over-etching. flexible array substrate

Method used

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  • Flexible array substrate, preparation method thereof and flexible display panel
  • Flexible array substrate, preparation method thereof and flexible display panel
  • Flexible array substrate, preparation method thereof and flexible display panel

Examples

Experimental program
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Effect test

Embodiment 1

[0041] Such as Figure 2 to Figure 5 As shown, this embodiment provides a flexible array substrate, which has a display area a and a bending area b (Bending area) connected to the display area a. The flexible array substrate includes:

[0042] flexible substrate 1;

[0043] A plurality of first wires 2 located on the flexible substrate 1, the plurality of first wires 2 are parallel to the first direction, and the projections of the plurality of first wires 2 on the flexible substrate 1 are arranged in sequence along a direction perpendicular to the first direction , the first direction is the direction that the display area a points to the bending area b (such as figure 2 , 4 , arrow x shown in 5);

[0044] The first insulating layer 3 is located on the side of the first wire 2 away from the flexible substrate 1, the first insulating layer 3 has a plurality of first via holes 31, and the first via holes 31 are located in the bending region b;

[0045] A plurality of secon...

Embodiment 2

[0067] Such as Figure 2 to Figure 5 As shown, this embodiment provides a method for preparing a flexible array substrate, based on the flexible array substrate of Embodiment 1, the preparation method includes:

[0068] S11 , forming a plurality of first wires 2 on the flexible substrate 1 .

[0069] Wherein, the first conductive wires 2 can be formed in two steps, that is, the odd-numbered first conductive wires 2 are formed first, and then the even-numbered first conductive wires 2 are formed, so that crosstalk between adjacent first conductive wires 2 can be avoided.

[0070] S12 , forming a first insulating layer 3 on a side of the first wire 2 away from the flexible substrate 1 .

[0071] Wherein, the first insulating material layer may be formed on the side of the first wire 2 away from the flexible substrate 1 first, and then the first insulating material layer is patterned to form the first insulating layer 3 with the first via hole 31 .

[0072] S13 , forming a seco...

Embodiment 3

[0079] Such as Image 6 As shown, this embodiment provides a flexible display panel, including the flexible array substrate of Embodiment 1, and the flexible array substrate can be bent at the bending region b.

[0080] Wherein, since the flexible substrate in the flexible display panel of this embodiment is bendable, the flexible array substrate is bendable in the bending area b, so that the structure located in the bending area b can be bent to the flexible array The back side of the substrate can increase the proportion of the entire screen where the display area a of the flexible display panel is located, that is, increase the screen-to-body ratio.

[0081] Specifically, the flexible display panel can be any product or component with a display function such as an organic light emitting diode (OLED) display panel, electronic paper, mobile phone, tablet computer, television, monitor, notebook computer, digital photo frame, and navigator.

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Abstract

The invention provides a flexible array substrate, a preparation method thereof and a flexible display panel, belongs to the technical field of display, and can at least partially solve the problem ofstress concentration caused by the fact that a long-strip-shaped groove is formed by over etching in the preparation process of an existing flexible array substrate. The flexible array substrate provided by the invention comprises a flexible substrate, a plurality of first wires located on the flexible substrate, a first insulating layer, a plurality of second wires and a second insulating layer.The second insulating layer comprises a plurality of first parts and second parts, each second part and the two adjacent first parts connected with the second part form a protection structure surrounding the corresponding second wire, and a first gap is formed between each second wire surrounded by the protection structure and the corresponding second part. One of every two adjacent second wiresis surrounded by one protection structure, or all the second wires are surrounded by the protection structures, and the positions of the first gaps corresponding to the adjacent second wires in a first direction are different.

Description

technical field [0001] The invention belongs to the field of display technology, and in particular relates to a flexible array substrate, a preparation method thereof, and a flexible display panel. Background technique [0002] In order to increase the screen-to-body ratio of the display area of ​​the display panel, a flexible substrate is generally used so that part of the frame of the display panel can be bent to the back of the display panel. [0003] However, in the bending area of ​​a flexible array substrate in the prior art, long grooves are formed on the insulating layer due to the overcutting of the insulating layer during the preparation process, resulting in stress concentration during bending. Thus, the lifespan of the flexible array substrate is affected. Contents of the invention [0004] The present invention at least partially solves the problem of stress concentration caused by easy formation of elongated grooves due to over-engraving in the existing flex...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/32G09F9/30
CPCG09F9/301H10K59/179H10K59/131
Inventor 周子琳宁玲琳熊小强谢海涛张典李江山毕瑞琳
Owner BOE TECH GRP CO LTD
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