Circuit board welding forming method
A welding forming and circuit board technology, which is applied in welding equipment, auxiliary devices, metal processing, etc., can solve the problems of poor subsequent processing of circuit boards, affecting the use of circuit boards, affecting the safety of circuit boards, etc., to achieve shearing effect Good, avoid bending, prevent cross-short circuit effect
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[0036] The embodiments of the present invention will be described in detail below with reference to the accompanying drawings, but the present invention can be implemented in many different ways defined and covered by the claims.
[0037] Such as Figure 1 to Figure 7 Shown, a kind of circuit board soldering forming method comprises the following steps:
[0038] S1. Glue on the circuit board: Manually apply a layer of adhesive on the position of the electrical components to be welded on the circuit board, and the adhesive is applied evenly, and the area of the application is smaller than the area of the electrical components;
[0039] S2. Electrical component patch: pass the electrical component pins to be soldered through the through holes on the circuit board manually, and the electrical components are bonded with the adhesive, and the adhesive applied in step S1 is glued with an oven or tunnel furnace curing;
[0040] S3. Wave soldering: use wave soldering to connect ...
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