Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Quantum principal component analysis method and device, electronic equipment and computer readable storage medium

A principal component analysis and quantum technology, applied in the field of quantum principal component analysis, can solve the problems of large quantum circuit depth, complex quantum circuit, and high performance requirements, and achieve the effect of simplifying depth and complexity

Active Publication Date: 2020-06-05
BEIJING BAIDU NETCOM SCI & TECH CO LTD
View PDF2 Cites 17 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, at present, purely using quantum computing methods for quantum principal component analysis requires complex quantum circuits, a large depth of quantum circuits, and high performance requirements for the quantum computers used. Quantum Principal Component Analysis of Noise on a Mesoscale Quantum Computer

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Quantum principal component analysis method and device, electronic equipment and computer readable storage medium
  • Quantum principal component analysis method and device, electronic equipment and computer readable storage medium
  • Quantum principal component analysis method and device, electronic equipment and computer readable storage medium

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0024] Exemplary embodiments of the present application are described below in conjunction with the accompanying drawings, which include various details of the embodiments of the present application to facilitate understanding, and they should be regarded as exemplary only. Accordingly, those of ordinary skill in the art will recognize that various changes and modifications of the embodiments described herein can be made without departing from the scope and spirit of the application. Also, descriptions of well-known functions and constructions are omitted in the following description for clarity and conciseness.

[0025] figure 1 A flow chart of a quantum principal component analysis method provided in the first embodiment of the present application, such as figure 1 As shown in , the method includes:

[0026] In S101, initial data is acquired.

[0027] In this step, the initial data is obtained, which is the data for principal component analysis. Since the initial data ne...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a quantum principal component analysis method and device, electronic equipment and a computer readable storage medium, and relates to the technical field of quantum computing.The implementation scheme adopted during quantum principal component analysis comprises the steps: acquiring initial data; copying and inputting the initial data into a quantum circuit, and determining a quantum measurement result of each quantum bit; according to the quantum measurement result of each quantum bit, calculating the value of a preset target function under the current circuit parameter of the quantum circuit; determining whether the value meets a preset condition or not, if the value does not meet the preset condition, updating the circuit parameter of the quantum circuit, turning to execute inputting of the copy of the initial data into the quantum circuit to determine a quantum measurement result, iteratively executing the process until the value meets the preset condition,and taking the current circuit parameter of the quantum circuit as a final parameter; and inputting the copy of the initial data into the quantum circuit corresponding to the final parameter, and obtaining a principal component analysis result of the initial data according to the quantum measurement result of each quantum bit.

Description

technical field [0001] The present application relates to the technical field of principal component analysis, and in particular to a quantum principal component analysis method, device, electronic equipment and computer-readable storage medium in the technical field of quantum computing. Background technique [0002] Principal component analysis of data is one of the most important methods for statistical analysis and simplification of data sets. Its redundant data compression and data noise elimination capabilities are widely used in various fields of artificial intelligence, such as image recognition and natural language processing. etc. have a very wide range of applications. [0003] With the rapid development of quantum computing technology, the use of quantum computing to achieve principal component analysis has gradually become a research hotspot. However, at present, purely using quantum computing methods for quantum principal component analysis requires complex qu...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06N10/00
CPCG06N10/00
Inventor 董莹段润尧
Owner BEIJING BAIDU NETCOM SCI & TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com