Wafer cleaning machine for physiotherapy instrument production

The technology of a physical therapy instrument and cleaning machine, which is applied in the field of wafer cleaning machines for the production of physical therapy instruments, can solve problems such as poor working effect of physical therapy instruments, affecting wafer effects, and scratches on the wafer surface, so as to prevent bumps and scratches. scratches, prevent force bumps, and reduce scratches

Inactive Publication Date: 2020-05-26
南京浦口科创投资集团有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies in the prior art, the object of the present invention is to provide a wafer cleaning machine for the production of physiotherapy instruments, to solve the problems in the prior art that the wafers are round and need to be cleaned in all directions when using ultrasonic waves for cleaning. In this process, the upper surface will be blocked and cannot be cleaned. When using the cleaning brush for auxiliary cleaning, the cleaning brush will touch the wafer or drive the wafer to the outside to contact the inner wall of the cleaning tank, resulting in scratches on the surface of the wafer. marks, which affect the effect of the wafer when it is made into an integrated circuit, and then make the working effect of the physiotherapy instrument poor.

Method used

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  • Wafer cleaning machine for physiotherapy instrument production
  • Wafer cleaning machine for physiotherapy instrument production
  • Wafer cleaning machine for physiotherapy instrument production

Examples

Experimental program
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Effect test

Embodiment 1

[0032] Example 1: Please refer to Figure 1-Figure 5 , the specific embodiments of the present invention are as follows:

[0033] Its structure includes caster 1, cabinet 2, drain pipe 3, case cover 4, cleaning mechanism 5, control panel 6, and described caster 1 is installed on the lower end of cabinet 2 and adopts mechanical connection, and described drain pipe 3 is embedded in cabinet 2 inside and It communicates with the cleaning mechanism 5. The box cover 4 is installed horizontally on the upper end of the cabinet 2 and connected by hinges. The cleaning mechanism 5 is embedded and installed inside the cabinet 2. Electrically connected by wires; the cleaning mechanism 5 includes an outer box 51, an ultrasonic transducer 52, an inner edge protection structure 53, a cleaning chamber 54, an auxiliary cleaning structure 55, and a rotating wheel 56, and the ultrasonic transducer 52 is embedded and installed Inside the outer box 51, the inner edge protection structure 53 is emb...

Embodiment 2

[0038] Example 2: Please refer to Figure 1-Figure 2 , Figure 6-Figure 12 , the specific embodiments of the present invention are as follows:

[0039] Its structure includes caster 1, cabinet 2, drain pipe 3, case cover 4, cleaning mechanism 5, control panel 6, and described caster 1 is installed on the lower end of cabinet 2 and adopts mechanical connection, and described drain pipe 3 is embedded in cabinet 2 inside and It communicates with the cleaning mechanism 5. The box cover 4 is installed horizontally on the upper end of the cabinet 2 and connected by hinges. The cleaning mechanism 5 is embedded and installed inside the cabinet 2. Electrically connected by wires; the cleaning mechanism 5 includes an outer box 51, an ultrasonic transducer 52, an inner edge protection structure 53, a cleaning chamber 54, an auxiliary cleaning structure 55, and a rotating wheel 56, and the ultrasonic transducer 52 is embedded and installed Inside the outer box 51, the inner edge protect...

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Abstract

The invention discloses a wafer cleaning machine for physiotherapy instrument production. The wafer cleaning machine structurally comprises caster wheels, a case, a drain pipe, a case cover, a cleaning mechanism and a control panel. The caster wheels are mounted at the lower end of the case, the drain pipe is embedded into the inner side of the case, the case cover is horizontally mounted at the upper end of the case, the cleaning mechanism is embedded into the inner side of the case, and the control panel is mounted on the front surface of the case. The cleaning mechanism comprises an outer case body, an ultrasonic transducer, an internal edge-protecting structure, a cleaning cavity, an auxiliary cleaning structure and a rotating wheel. The ultrasonic transducer is mounted in the inner side of the outer case body in an embedded manner, the internal edge-protecting structure is embedded into the inner side of the outer case body, the cleaning cavity is formed in the inner side of the internal edge-protecting structure, and the lower end of the auxiliary cleaning structure is mounted in the inner side of the outer case body in an embedded manner. As the internal edge-protecting structure is arranged in the inner side of the outer case body, a part in contact with a wafer is buffered while the wafer is cleaned all around to prevent collision and scratches of the wafer, so that aneffect of manufacturing an integrated circuit by the wafer is better improved.

Description

technical field [0001] The invention belongs to the field of wafer processing, and in particular relates to a wafer cleaning machine for the production of physiotherapy instruments. Background technique [0002] Physiotherapy instrument, also known as physical therapy instrument, mainly uses equipment to act on physical factors on the human body to achieve the effect of treatment, and the circuit in the physiotherapy instrument needs to use wafers to make integrated circuits to make the equipment run. Therefore, crystal The circle plays a big role in it, and the wafer needs to be cleaned after the production is completed in order to play a better role. If the wafer is not cleaned cleanly or there are scratches on the surface that affect the smoothness of the wafer surface, it will affect the smoothness of the wafer surface. To the working effect of physical therapy instrument, but there are following deficiencies in the prior art: [0003] Since the wafer is round and needs...

Claims

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Application Information

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IPC IPC(8): B08B3/12B08B1/00B08B1/04B08B3/10H01L21/67
CPCB08B3/12B08B3/10H01L21/67046B08B1/32B08B1/12
Inventor 闫玉飞
Owner 南京浦口科创投资集团有限公司
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