Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Etching method and device

An etching device and etching technology are applied in the field of etching technology to achieve the effect of uniform spraying of etching liquid

Pending Publication Date: 2020-05-19
FOSHAN HENGHAO TECH
View PDF0 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the method of scouring etching, it is necessary to ensure that the etching solution is sprayed evenly and that the etching solution can flow away quickly after spraying to ensure that fresh etching solution is continuously washed to the surface of the material. So far, there is no effective technology to achieve the above requirements

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Etching method and device
  • Etching method and device
  • Etching method and device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0020] Now in conjunction with accompanying drawing and embodiment the present invention is described in further detail:

[0021] Such as figure 1 , 2 As shown, the etching device of the present invention is realized in this way, including a box-shaped frame 1, a rotating power a arranged on the frame 1, a rotating disk 2 driven by the rotating power a, and a rotating disk 2 arranged on the rotating disk 2. The workpiece fixing mechanism b and the etching liquid spraying mechanism c are special in that the rotating power a includes the motor drive mechanism 3, which is driven by the motor drive mechanism 3 (including motors, pulleys, belts or including motors, sprockets, and chains) to synchronize and The cam 4 rotates in the same direction, the transmission surface of the cam 4 is provided with a groove 5, the lower edge of the rotating disk 2 leans against the groove 5 of the transmission surface of the two convex, 4, and the upper part of the rotating disk 2 is provided wi...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an etching method and device. The device is characterized in that two cams rotate; a rotating disc leaning against the two cams is driven to rotate; the rotating disc shakes upand down and left and right; a pumping device pumps an etching liquid to a nozzle on a vertical pipe on a side surface of the rotating disc and sprays the etching liquid out through the nozzle, a power mechanism drives a connecting rod to move left and right, the connecting rod drives a swing rod to swing, the vertical pipe rotates within a certain radian range, and the nozzle sprays the etchingliquid onto a workpiece on the rotating disc within a certain radian range. Compared with the prior art, by using the method and the device of the invention, advantages that the etching solution is sprayed uniformly, and the etching solution can flow away quickly after being sprayed are achieved.

Description

technical field [0001] The invention relates to an etching technique. Background technique [0002] Existing etching is to use etchant to continuously flush the surface of the board to be etched, and to erode the material on the board surface that is not covered (such as the copper plate part that is not covered by printing on the circuit board) until the board that is not covered The material on the face is completely removed, leaving the shaded parts. In the method of scouring etching, it is necessary to ensure that the etching solution is sprayed evenly and that the etching solution can flow away quickly after spraying, so as to ensure that fresh etching solution is continuously washed to the surface of the material. So far, there is no effective technology to achieve the above requirements. Contents of the invention [0003] The object of the present invention is to provide an etching method and device that can spray the etching liquid uniformly and quickly flow away...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/06
CPCH05K3/068
Inventor 梁志恒
Owner FOSHAN HENGHAO TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com