Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A chip sorting and unloading device

A chip and blanking technology, applied in the directions of transportation and packaging, furnace, charge control, etc., can solve the problems of labor and low work efficiency, and achieve the effect of improving efficiency, high blanking efficiency and reducing labor efficiency.

Active Publication Date: 2021-11-05
云道图山东智能技术有限公司
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the problem of low work efficiency in the common manual cutting method and low working efficiency after chip programming and sorting, and proposes a chip sorting and cutting device

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A chip sorting and unloading device
  • A chip sorting and unloading device
  • A chip sorting and unloading device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0022] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.

[0023] In describing the present invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", " The orientation or positional relationship indicated by "outside", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, so as to Specific orientation configurations and operations, therefore, are not to be construed as limitations on the invention.

[0024] refer to Figure ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a chip sorting and unloading device, which belongs to the field of electric technology. A chip sorting and unloading device, comprising a connecting frame, on which several frames are arranged, on which a first splint and a second splint are arranged, and one side of the sleeve is fixedly connected to one side of the inner wall of the frame One side of the second splint is provided with a slope, one end of the second splint is provided with a rubber sleeve, one end of the rubber sleeve is provided with a second movable block, and the outside of the second movable block is provided with a transmission rod. In the present invention, the chip can be clamped by the first splint and the second splint, and the second movable block can be driven to move by the transmission rod, so that the second splint is far away from the first splint, so that the chip is not clamped. The chip will fall down, which realizes the purpose of cutting and improves the working efficiency of the staff.

Description

technical field [0001] The invention relates to the technical field of electric technology, in particular to a chip sorting and unloading device. Background technique [0002] The MCU in the chip is a single-chip microcomputer, which also includes various components such as resistors or capacitors to form a chip. The reverse side can be a metal terminal, a burning point, and the metal terminal is used to contact the device and communicate with it. For example, the chip is installed on the After the printer powder box, it can communicate with the printer. The burning point is a separately set point. It can contact the burning point through the burning device to carry out the burning program. The chip can only be programmed after the MCU is burned into the program. , to perform a certain function. [0003] After the chip is burned, it needs to be tested. After the test, the chip needs to be removed. The common way to remove it is to take it down one by one. The work efficienc...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B65G49/06B65G47/90
CPCB65G47/90B65G49/06
Inventor 周露露李立
Owner 云道图山东智能技术有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com