Micro-element transfer device and transfer method thereof

A transfer method and micro-component technology, which is applied in the manufacture of electrical components, semiconductor/solid-state devices, circuits, etc., can solve problems such as poor reliability of electrostatic pickup, and achieve the effects of mass transfer, low transfer cost, and simple transfer process

Active Publication Date: 2020-05-08
CHENGDU VISTAR OPTEOLECTRONICS CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Among them, the extraction of micro-element arrays is generally performed by electrostatic pickup, but the reliability of electrostatic pickup is relatively poor

Method used

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  • Micro-element transfer device and transfer method thereof
  • Micro-element transfer device and transfer method thereof
  • Micro-element transfer device and transfer method thereof

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Embodiment Construction

[0033] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0034] Micro components have strong application prospects in the display field. However, because micro-components are too "miniature", components may be smaller than 100 microns, and the difficulty of production lies in how to transfer and paste millions of tiny micro-component components onto a panel. The existing batch transfer technology has always been a bottleneck restricting its application. In order to realize batch transfer of micro components more con...

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Abstract

The invention discloses a micro-element transfer device and a transfer method thereof. The transfer device comprises a chip mounting head and an ejector pin platform. One side of the chip mounting head comprises a plurality of bumps arranged in an array, an adhesive layer is arranged on the bumps, when the adhesive layer is in a first state, the adhesive layer has viscosity and is used for adhering a micro element, and when the adhesive layer is in a second state, the viscosity of the adhesive layer disappears, and the micro element is released. The ejector pin platform is located on a back surface of a flexible film layer pasted with a micro-element, the ejector pin platform comprises an ejector pin and an ejector pin hole, and the ejector pin penetrates through the ejector pin hole to eject the micro-element, so that the micro-element adheres to the adhesion layer of the chip mounting head. By means of the transfer device, a large number of micro elements can be transferred, the transferring process is simple, and the transferring cost is low.

Description

technical field [0001] The present application relates to micro-component processing technology, in particular to a micro-component transfer device and a transfer method thereof. Background technique [0002] Due to the small size and huge number of micro components, there will be tens of thousands or even hundreds of thousands of small particles on a display screen. It will take a lot of time to bind them to the backplane one by one. Therefore, how to integrate It is very difficult to transfer large quantities of very small micro components to the backplane. [0003] The traditional method of transferring micro-components is to transfer micro-components from a transfer substrate to a receiving substrate by substrate bonding (Wafer Bonding). One implementation method of the transfer method is direct transfer, that is, the micro-device array is directly bonded from the transfer substrate to the receiving substrate, and then the transfer substrate is removed. Another method ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
CPCH01L21/67144
Inventor 陈波
Owner CHENGDU VISTAR OPTEOLECTRONICS CO LTD
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