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TR assembly control circuit based on full bare chip

A technology for controlling circuits and bare chips, used in radio wave measurement systems, instruments, etc., can solve the problems of large volume occupied by programmable logic devices and drivers, unfavorable miniaturization and light weight of TR components, and failure to load software.

Active Publication Date: 2020-05-08
BEIJING INST OF RADIO MEASUREMENT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, programmable logic devices and drivers occupy a large volume in the control circuit, which is not conducive to the miniaturization and lightweight of TR components. In high and low temperature environments or in harsh power environments, software loading failures may occur with a certain probability, which is not conducive to TR component reliability

Method used

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  • TR assembly control circuit based on full bare chip
  • TR assembly control circuit based on full bare chip
  • TR assembly control circuit based on full bare chip

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Embodiment Construction

[0025] In order to make the technical solutions and advantages of the present invention clearer, the implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0026] An embodiment of the present invention proposes a TR component control circuit based on a full-die form, and the control circuit includes: a chip group.

[0027] Specifically, the die group is used to receive the control signal output by the wave control machine, and the die group includes multi-level dies electrically connected in series (in this embodiment, the number of dies can be defined as N , wherein, N is an integer greater than 1. Those skilled in the art should know that the number of dies can be set by themselves, and the application does not specifically limit this). Here, each die is electrically connected to Multifunctional sub-circuit, power amplifier sub-circuit and ring amplifier sub-circuit.

[0028] In the embodime...

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Abstract

The invention discloses a TR assembly control circuit based on a full bare chip. The circuit comprises a bare chip group which is used for receiving a control signal outputted by a wave control machine. The bare chip group comprises multiple stages of bare chips which are electrically connected in series, and each bare chip is electrically connected with a multifunctional sub-circuit, a power amplifier sub-circuit and a loop amplifier sub-circuit. According to the invention, the reliability of the TR assembly is improved.

Description

technical field [0001] The invention relates to the technical field of integrated circuits. More specifically, it relates to a full-die-based TR component control circuit. Background technique [0002] With the continuous development of active phased array radar technology, the reliability, miniaturization and light weight of array TR components are becoming more and more important. The traditional TR module control circuit is mainly composed of power supply, monitoring circuit, programmable logic device, driver, resistor and capacitor, such as figure 1 shown. The programmable logic device outputs all control signals, and controls the power amplifier circuit, ring amplifier circuit and multi-function circuit after being processed by the driver. [0003] However, programmable logic devices and drivers occupy a large volume in the control circuit, which is not conducive to the miniaturization and lightweight of TR components. In high and low temperature environments or in h...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01S7/02
CPCG01S7/02
Inventor 沈飞跃孙永敏张玉霞
Owner BEIJING INST OF RADIO MEASUREMENT
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