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Heat dissipation device for mobile device and control method thereof

A technology for heat dissipation device and mobile equipment, applied in non-electric variable control, control/regulation system, and simultaneous control of multiple variables, etc., can solve the problems of poor fan cooling effect, high noise and influence of fan components, and prevent condensation. Phenomenon, effect of zero noise

Active Publication Date: 2020-05-05
GREE ELECTRIC APPLIANCES INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The heat dissipation effect of thermoelectric cooling is good, but in the current technical solution, precise temperature control is not achieved, and condensation is likely to occur in the contact area between the cold end of the thermoelectric module and the mobile phone, while the cooling effect of the fan is poor, and the noise is large, which affects the user's use Experience when playing games or watching videos on mobile phones
That is, the existing external heat dissipation has the following problems: when the mobile phone uses thermoelectric cooling for heat dissipation, it is easy to generate condensation; the fan assembly for heat dissipation at the hot end of the thermoelectric cooling module has the problems of large noise and large volume

Method used

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  • Heat dissipation device for mobile device and control method thereof
  • Heat dissipation device for mobile device and control method thereof
  • Heat dissipation device for mobile device and control method thereof

Examples

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Embodiment Construction

[0028] Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals denote the same or similar parts in the drawings, and thus their repeated descriptions will be omitted.

[0029] Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided in order to give a thorough understanding of embodiments of the present disclosure. However, those skilled in the art will appreciate that the technical solutions of the present disclosure may be practiced without one or mo...

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Abstract

The invention discloses a control method of a heat dissipation device for a mobile device and the heat dissipation device. The temperature and the environment humidity of the backboard of the mobile device are detected through the detection module, the dew point temperature td is calculated through the control module according to the temperature and the environment humidity, the temperature of thecold end of the semiconductor chilling plate of the heat dissipation device is controlled according to the control module, and therefore the condensation phenomenon is prevented. Foam metal is preferably adopted as a heat dissipation material to replace a common heat dissipation fan, zero noise is achieved, and the heat dissipation device is more compact and miniaturized.

Description

technical field [0001] The present invention relates to a heat dissipation device for a mobile device and a control method thereof, in particular to a heat dissipation device for a mobile phone and a control method thereof. Background technique [0002] In the era of smart phones, as the main frequency is getting higher and higher, the power consumption is getting higher and higher, and the heat generation is getting higher and higher. Especially when the phone is charging and playing heavy games or watching high-definition video, the heat generated by the phone reaches the maximum. When the mobile phone generates the most heat, it is easy to crash or burn the hardware due to the excessive heat generation of the mobile phone, thereby reducing the service life of the mobile phone; When the phone is hot, it will reduce the experience of people using the mobile phone. [0003] There are two types of heat dissipation solutions for mobile phones: internal heat dissipation and e...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G05D27/02H05K7/20
CPCG05D27/02H05K7/20H05K7/2039
Inventor 高源
Owner GREE ELECTRIC APPLIANCES INC
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