Bubble defect monitoring method and device, server and readable storage medium

Abstract

The invention provides a bubble defect monitoring method and device, a server and a readable storage medium. According to the bubble defect monitoring method and device, the server and the readable storage medium, gray analysis is performed on the scanning image of a bonded wafer, so that the pixel gray value of bubble defects is obtained; and therefore, the bubble defects can be monitored throughthe pixel gray value. With the bubble defect monitoring method and device, the server and the readable storage medium of the invention adopted, the size, shape and number of the bubble defects can beautomatically monitored on line; a manual visual inspection mode can be avoided; detection efficiency is high, accuracy is high; reliability is good; a bubble breaking probability is reduced; economic loss is reduced; production efficiency is improved; and relatively high economic value is realized.

Description

technical field [0001] The invention belongs to the technical field of semiconductor manufacturing, and relates to a bubble defect monitoring method, device, server and readable storage medium. Background technique [0002] In the wafer bonding (Bond) process, when there is an abnormality in the bonding process, bubble defects will appear in the bonded wafer. Once the size of the bubble defect reaches the millimeter level, the bonded wafer will not There may be a risk of bubbles bursting, and the shape of the bubble defect is also an important indicator of the bubbles breaking. [0003] In the semiconductor manufacturing process, the bursting of the bubbles in the bonded wafer will not only reduce the yield of the wafer, but even cause the wafer to be scrapped in severe cases, and will also pollute the process equipment to further contaminate other wafers. Expanded the scope of influence, resulting in greater economic losses. Therefore, the bubble defect in the bonded wafe...

AI Technical Summary

Problems solved by technology

[0005] 1. Unable to monitor millimeter-level air bubble defects;

[0006] 2. The shape of bubble defects cannot be monitored

[0007] Therefore, the existing online air bubble defect monitoring system is almost ineffective in monitoring the air bubble defects in the bonded wafers. In the process, it is usually necessary to rely on manual visual inspection to monitor the air bubble defects in the bonded wafers.

However, the manual visual inspection method is inefficient, thereby reducing production efficiency, and is prone to human judgment errors, resulting in low detection accuracy and poor reliability.

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