Optical module

Abstract

The invention discloses an optical module. A circuit board is provided with a first heat dissipation piece, an optical chip is attached to one end of the first heat dissipation piece, the other end ofthe first heat dissipation piece extends out of a lens assembly, the lens assembly covers the optical chip, a third heat dissipation piece and a through hole are arranged in the circuit board, and the first heat dissipation piece and the third heat dissipation piece are in heat conduction connection through the through hole. A second heat dissipation piece is arranged at the other end of the first heat dissipation piece and provided with a heat conduction piece, and the heat conduction piece is in heat conduction connection with an upper shell. The first heat dissipation piece conducts heat generated by the optical chip to the third heat dissipation piece, the third heat dissipation piece diffuses the heat and then conducts the heat to the first heat dissipation piece through the throughhole, and the first heat dissipation piece conducts the total heat to the second heat dissipation piece, and then the total heat is conducted to the upper shell through the heat conduction piece. Visibly, according to the optical module provided by the invention, the heat generated by the optical chip is diffused out of the coverage area of the lens assembly by utilizing the first heat dissipationpiece and the third heat dissipation piece, and then heat dissipation is realized by the second heat dissipation piece, the heat conduction piece and the upper shell, so that the heat dissipation effect is better.

Description

technical field [0001] The invention relates to the technical field of optical fiber communication, in particular to an optical module. Background technique [0002] With the advent of the 5G era, in order to achieve the requirements of 5G large bandwidth capacity, low latency, and network slicing, it is necessary to increase the transmission rate of optical communication. In order to increase the transmission rate of optical communication, 400G optical modules are used in this field to realize the transmission and reception of light of different wavelengths. [0003] The 400G optical module includes a printed circuit board (Printed Circuit board, referred to as: PCB), a laser set on the printed circuit board, a detector, and a driver chip for driving the laser and the detector. on the corresponding pad. Each device will generate heat during operation. If the heat cannot be dissipated quickly, the ambient temperature will continue to rise and affect the performance of the ...

AI Technical Summary

Problems solved by technology

[0004] The present invention provides an optical module to solve the problem of poor heat dissipation effect of the existing heat dissipation method for high energy density optical modules

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