A kind of magnetron sputtering method of BGA electromagnetic shielding product

Abstract

The invention relates to a magnetron sputtering method for BGA electromagnetic shielding products, which comprises the following steps: step 1, taking a sputtering tape; step 2, using a heated punching die to punch through holes of corresponding sizes on the sputtering tape , and form a slope by pressing on the surface of the sputtering tape near the edge of the through hole; step 3, attach the sputtering tape with the through hole to the sputtering carrier first, and then place the BGA product on the corresponding sputtering tape At the position of the through hole, use a pressing machine to press down the BGA product before sputtering, so that the solder balls on the outermost circle of the bottom edge of the BGA product can fall into the sputtering tape on the slope, and then perform the sputtering operation; Step 4, BGA product After the sputtering operation is completed, the sputtering tape is heated to above 175°C, so that the plastic memory metal film returns to the memory shape, and the BGA product is separated from the sputtering tape spontaneously. By designing the structure and material of the BGA sputtering tape, the invention can protect the tin balls from being sputtered during the sputtering process, and the tin balls bounce off the plastically deformed sputtering tape, and simultaneously realize the spontaneous separation of the product from the sputtering tape.

Description

technical field [0001] The invention relates to a magnetron sputtering method for BGA electromagnetic shielding products, belonging to the technical field of semiconductor packaging. Background technique [0002] The basic manufacturing process of traditional BGA sputtering is as follows: [0003] Such as figure 1 As shown, the sputtering tape 1 is formed into a through hole 5, and the sputtering tape 1 is first attached to the sputtering carrier 2 with the opening 3, and then the BGA product 4 is placed on the sputtering tape 1 corresponding to the through hole 5 In terms of position, before sputtering, the BGA product 4 needs to be pressed down with a press machine, so that the solder ball 6 on the bottom edge of the BGA product 4 is trapped in the sputtering tape 1, so as to ensure that the substrate and the sputtering tape are tightly bonded to prevent the sputtering process from The bottom of the product is overflow-plated, and then the sputtering operation is carried...

AI Technical Summary

Problems solved by technology

[0007] 3. In the above-mentioned traditional BGA sputtering method, the solder balls fall into the sputtering tape with the help of external force. Due to the elastic deformation of the sputtering tape, it will gradually rebound with time, causing the solder balls to pop out of the tape, resulting in overflow plating of the product;

[0008] 4. In the above-mentioned traditional BGA sputtering method, during the pick-up process after sputtering, upward pressure is applied on the tin ball surface through the thimble, and at the same time, the product surface is sucked by the suction nozzle, and the product is removed from the sputtering tape and put into the receiving tray. There is a risk of damage to solder balls during pick-up, affecting the appearance and performance of the product

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