Bonding machine lead mechanism and working method
A technology of bonding machine lead and bonding machine, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problem of low bonding efficiency and precision, affecting bonding quality and bonding efficiency, and inability to perceive metal wires Tension and other problems, to avoid the effect of excessive tension
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[0026] In the following description, numerous specific details are given in order to provide a more thorough understanding of the present invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced without one or more of these details. In other examples, some technical features known in the art are not described in order to avoid confusion with the present invention.
[0027] Wire bonding is one of the common and important production processes in the semiconductor industry. The applicant found that most of the existing bonding machine lead clamps control the displacement of the lead clamp and the clamping force on the lead according to the data detected by the detection components and the displacement amplifier, but Since the wire used for bonding is made of metal, and the wire itself has a certain tension during welding or molding, the tension of the wire and the clamping force of the clamp directly affect the bonding quality...
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