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Magnetic control type self-centering chip wafer robot complete machine

A self-centering, magnetically controlled technology, applied in semiconductor/solid-state device manufacturing, electrical components, workpiece clamping devices, etc., can solve problems such as wafer damage, to avoid wear and tear, clamping force balance, clamping more tightening effect

Inactive Publication Date: 2020-04-10
荆门欧曼凯机电设备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] The invention patent with the patent number of 201210218852.9 proposes a wafer clamping device using spring clips, which has the function of wafer clamping and positioning; Damage to the fragile wafer, causing sliding friction between the wafer and the slider

Method used

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  • Magnetic control type self-centering chip wafer robot complete machine
  • Magnetic control type self-centering chip wafer robot complete machine
  • Magnetic control type self-centering chip wafer robot complete machine

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Embodiment Construction

[0022] The present invention will be described in further detail below in conjunction with the accompanying drawings and specific embodiments, and the implementation scope of the present invention is not limited thereto.

[0023] Such as Figure 1 to Figure 7 As shown, the complete machine of a magnetically controlled self-centering chip wafer cleaning robot described in this embodiment includes a rotating round table a1, and a plurality of mechanical arms a2 are arranged around the center on the rotating round table, and each mechanical arm The free end of a2 is provided with a magnetron clamp.

[0024] The magnetic control fixture includes a base 1, three support pads 2, and a floating shaft 3. The base 1 has an inner ring 11 and an outer ring 12 arranged concentrically, and the three support pads 2 are fixed on the base 1. The inner ring 11 is distributed in an equilateral triangle, the outer ring 12 of the base 1 is slidably connected with three jaws 4, and the three jaws...

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Abstract

The invention discloses a magnetic control type self-centering chip wafer cleaning robot complete machine which comprises a grabbing disc with a vacuum suction cup, the grabbing disc is used for grabbing a wafer and placing the grabbed wafer on three supporting pads, an upper magnet is arranged in the middle of the grabbing disc, and the magnetism of the upper magnet is the same as that of the lower magnet; and the magnetic field force between the lower magnet and the upper magnet is used as a power source of centrifugal motion of the three clamping jaws, so that the edge of the wafer is not in contact with the clamping jaws and does not slide when the wafer is placed, and the wafer is prevented from being abraded and scratched.

Description

technical field [0001] The invention relates to a complete magnetically controlled self-centering chip wafer cleaning robot. Background technique [0002] The invention patent with the patent number of 201210218852.9 proposes a wafer clamping device using spring clips, which has the function of wafer clamping and positioning; Damage to the fragile wafer causes sliding friction between the wafer and the slider. Contents of the invention [0003] The object of the present invention is to overcome the above-mentioned shortcomings and provide a complete magnetically controlled self-centering chip wafer cleaning robot. [0004] To achieve the above object, the specific scheme of the present invention is as follows: [0005] A complete magnetically controlled self-centering chip wafer cleaning robot includes a rotating round table on which a plurality of robotic arms are arranged around the center, and a magnetically controlled clamp is arranged at the free end of each robotic...

Claims

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Application Information

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IPC IPC(8): H01L21/683H01L21/687B25B11/00
CPCB25B11/00H01L21/6838H01L21/68707
Inventor 李琳芳
Owner 荆门欧曼凯机电设备有限公司
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