Wafer mounting base capable of preventing wafer from shaking and deviating and wafer lifting device

A mounting seat and wafer technology, which is applied in the manufacture of electrical components, circuits, semiconductors/solid-state devices, etc., can solve problems such as polluted wafers, wafer damage in boxes, etc., to reduce damage rate, simple structure, and reduce production costs Effect

Active Publication Date: 2020-04-10
PNC PROCESS SYSTEMS CO LTD +1
View PDF8 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of this, the present invention provides a wafer mounting seat and a wafer lifting device for avoiding wafer shaking and shifting, so as to solve ...

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Wafer mounting base capable of preventing wafer from shaking and deviating and wafer lifting device
  • Wafer mounting base capable of preventing wafer from shaking and deviating and wafer lifting device
  • Wafer mounting base capable of preventing wafer from shaking and deviating and wafer lifting device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0031] In order to better understand the technical solutions of the present invention, the embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0032] It should be clear that the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0033] The present application will be described in further detail below through specific embodiments and in conjunction with the accompanying drawings.

[0034] In the description of this application, unless otherwise clearly specified and limited, the terms "first" and "second" are only used for the purpose of description, and cannot be understood as indicating or implying relative importance; unless otherwise specified or stated , ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a wafer mounting base capable of preventing a wafer from shaking and deviating and a wafer lifting device. The wafer mounting base comprises a base and clamping plates, the clamping plates are buckled on the two sides of the base and locked and fixed to the base through fasteners, tooth groove structures are arranged at the upper ends of the clamping plates, and each toothon each tooth groove structure is provided with a tooth back, a tooth front and a tooth tip formed at the intersection of the tooth back and the tooth front. The wafer mounting base is simple in structure and convenient to use, the wafers can be prevented from shaking or deviating in the wafer moving process by arranging the special tooth groove structures on the clamping plates, the breakage rateof the wafers is greatly reduced, the broken wafers are prevented from polluting other unbroken wafers or polluting production line equipment, and the production cost of enterprises is reduced.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a wafer mounting seat and a wafer lifting device for avoiding wafer shaking and offset. Background technique [0002] With the continuous support of national policies and funds, the continuous and high-intensity R&D investment of localized equipment and the independent mastery of core technologies are increasing. Among them, the load, movement of semiconductor wafers or the placement required for the use of process flow The application design and technical concepts of wafer or batch wafer and other related components and module devices applied to various process flows emerge as needed. [0003] The wafer mounting seat is used to place a single wafer or a batch of wafers on the mounting seat by clamping or holding. However, during the movement of the wafer mounting seat, due to the impact of external force, the wafer mounting seat will The wafers in the casset...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H01L21/673
CPCH01L21/67309
Inventor 陈佳炜李志峰王雪松徐铭
Owner PNC PROCESS SYSTEMS CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap