Fool-proof system capable of realizing automatic addition of electroplating solution and use method of fool-proof system

Abstract

The invention discloses a fool-proof system capable of realizing automatic addition of an electroplating solution. The fool-proof system comprises an electric quantity detecting module for detecting the consumed electric quantity of an electroplating cylinder, a chemical drawing module for drawing a chemical from a chemical addition barrel, a chemical addition module for adding the chemical to thechemical addition barrel, a liquid level sensing module for detecting the liquid level of the electroplating solution in the chemical addition barrel, a warning module, a display module for displaying warning types, a database for saving data, a time module for acquiring real time, a data processing module for processing data of the electric quantity detecting module, the liquid level sensing module, the time module and the database as well as an information resetting module for performing reset clearing on data of the time module and the data processing module. According to the fool-proof system, automatic chemical drawing and addition can be performed on the chemical addition barrel, so that the electroplating solution in the electroplating cylinder can be kept at the certain content; and effective warning can be performed when components break down, so that an operator is warned to perform detection, and the electroplating quality of circuit boards is guaranteed.

Description

technical field [0001] The invention relates to the field of circuit board production, in particular to a fool-proof system for automatic addition of electroplating solution and a use method thereof. Background technique [0002] In the current production process of the electroplating process in the PCB industry, the traditional automatic electroplating solution addition system has a large quality risk, often due to component failures or manual operation errors, resulting in missing, less or no addition of electroplating solution, etc. Phenomena, resulting in insufficient or excessive plating liquid content in the electroplating liquid tank and other adverse consequences, thereby reducing the plating quality of the circuit board and increasing the production cost of the circuit board. Contents of the invention [0003] The present invention aims to solve at least one of the technical problems existing in the prior art. For this reason, the present invention proposes a foo...

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Problems solved by technology

[0002] In the current production process of the electroplating process in the PCB industry, the traditional automatic electroplating solution addition system has a large quality risk, often due to component failures or manual operation errors, resulting in missing, less or no addition of electroplating solution, etc. Phenomenon, resulting in insufficient or excessive plating liquid content in the electroplating potion and other adverse consequences, thereby reducing the plating quality of the circuit board and increasing the production cost of the circuit board

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