Electronic equipment housing, preparation method thereof and electronic equipment
A technology for electronic equipment and housing, applied in the field of electronic equipment housing and its preparation, can solve problems such as failure to meet aesthetic requirements and the like
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[0020] Embodiments of the present invention are described in detail below. The embodiments described below are exemplary only for explaining the present invention and should not be construed as limiting the present invention. If no specific technique or condition is indicated in the examples, it shall be carried out according to the technique or condition described in the literature in this field or according to the product specification. The reagents or instruments used were not indicated by the manufacturer, and they were all commercially available conventional products.
[0021] In one aspect of the present application, the present application provides an electronic equipment housing. According to the embodiment of the application, refer to figure 1 and figure 2 , the electronic device housing includes: a housing body 10, the housing body 10 includes a bottom wall 12 and at least one side wall 14 connected to the bottom wall 12, the inner surface 121 of the bottom wall ...
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