Strip high-vacuum cathode arc target device

Abstract

The invention discloses a strip high-vacuum cathode arc target device. A vacuum chamber is used for placing the strip high-vacuum cathode arc target device; the device comprises a main support frame,an anode, a cathode target, a shielding electrode, a first shielding ring, a permanent magnet, a triggering electrode and a rotating part; the rotating part is mounted on the main support frame, is fixedly connected with the cathode target, and is rotated; the anode is connected with the main support frame; the first shielding ring is fixed on the anode for shielding the cathode target and the vacuum chamber; the shielding electrode wraps the cathode target; the permanent magnet is arranged in the cathode target; and the triggering electrode is mounted on the shielding electrode, and is electrically connected with a triggering power supply. The strip high-vacuum cathode arc target device realizes stable and reliable arc light discharge under high vacuum, meanwhile, greatly reduces the particle spraying caused by higher temperature during arc striking, and prolongs the cathode life.

Description

technical field [0001] The invention relates to the technical field of coating, in particular to a long high vacuum cathode arc target device. Background technique [0002] With the rapid development of science and technology, the requirements for material surface modification technology are getting higher and higher, and the traditional single surface modification technology has become increasingly difficult to meet the technical requirements of industrial production; synthesis, integration and multi-function become the trend of technological development. [0003] In recent years, some surface modification composite technologies have come out and been put into the industry one after another, and play an important role. For example, the composite technology of magnetron sputtering technology and arc ion plating technology is compatible with the advantages of magnetron sputtering technology that can deposit large-area and high-uniformity films and the advantages of ion plati...

AI Technical Summary

Problems solved by technology

However, it has an important disadvantage, that is, the density of the deposited film is not high, there are micron-sized large particles, the size of the workpiece is limited, and the temperature-sensitive substrate is not suitable, etc.

Magnetic filtration cathodic vacuum arc deposition technology is a new type of ion beam film preparation method developed in recent years. It uses magnetic filtration technology to filter out large particles and neutral atoms generated by the arc source to obtain a pure plasma beam without large particles. It effectively overcomes the problems caused by the existence of large particles in the ordinary arc source deposition method, and the prepared film has excellent performance, but the important disadvantage of the direct current magnetic filtration deposition technology is that the effective area of ​​the film layer is limited, and the effective area is in diameter. Within 160mm, uniform coating cannot be achieved on the surface of some large-sized workpieces

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