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Joining method for connecting components

A joint method and component technology, applied in the direction of connecting components, cold-pressed connection, material gluing, etc., can solve problems such as damage, achieve short process time, short holding time, and reduce deformation

Inactive Publication Date: 2020-02-25
VOLKSWAGEN AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, the previously known sintering devices and sintering methods can lead to damage of the components to be joined if these components are of thin-walled or brittle design.

Method used

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  • Joining method for connecting components
  • Joining method for connecting components
  • Joining method for connecting components

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0070] figure 1 A schematic representation of a system 100 for connecting a first component 10 to a second component 20 according to one embodiment of the invention is shown.

[0071] The first component 10 is designed as a semiconductor module which is mounted on the second component 20 . The second component 20 is embodied as a tubular and partially open extruded profile with a hollow space 21 .

[0072] A bonding material 11 is arranged between the first component 10 and the second component 20 . According to the present embodiment, the bonding material 11 is a sintered material.

[0073] In this case, the first component 10 and the second component 20 can be thin-walled and / or mechanically unstable and can have any shape.

[0074] The system 100 has an engagement device 30 with a pressing chamber 31 and a component chamber 32 . The abutment chamber 31 has a punch 40 which can be controlled via a drive 41 for applying the abutment force F 压靠 applied to the first member...

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PUM

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Abstract

The invention relates to a joining method (80) for the positionally fixed connection of a first component (10) to a second component (20) under pressure loading, the first component (10) being arranged between a punch (40) and the second component (20), the ambient pressure (p-chamber) of the first component (10) and the ambient pressure (pi) of the second component (20) are synchronously increased to the working pressure, the working pressure is maintained for a defined duration or the ambient pressure (p-chamber) of the first component is continuously reduced after the working pressure is reached, thus generating a pressure difference. Further, a system (100) is disclosed.

Description

technical field [0001] The invention relates to a joining method for connecting a first component to a second component in a positionally fixed manner under pressure loading and to a system for connecting a first component to a second component. Background technique [0002] In many technical fields there is a need to connect a plurality of components to one another, in particular with a material fit. For example, in the case of electronic components, the components to be cooled can be connected to the heat sink in such a way that heat transport to the components in the heat sink takes place with as little loss as possible. For this purpose, corresponding components can be screwed, riveted, soldered or glued to the heat sink. Such components can be, for example, semiconductors or semiconductor modules. [0003] However, depending on the materials of the components to be connected together, a long-lasting bonded connection may not be possible or only difficult to achieve by...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F16B11/00
CPCF16B11/006F16B11/004
Inventor O.兰格A.勒希M.普里斯J.U.米勒M.齐默曼
Owner VOLKSWAGEN AG
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