Preparation method of underwater acoustic transducer shielding layer

An underwater acoustic transducer and shielding layer technology, applied in the direction of sensors, electrical components, etc., can solve the problems of high requirements on the shape of the transducer, complicated fixing methods of the shielding net, etc., and achieves low impact on acoustic performance, high reliability, Good shielding performance

Active Publication Date: 2019-12-24
上海船舶电子设备研究所
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  • Application Information

AI Technical Summary

Problems solved by technology

The shielding method of the mesh metal layer used in the past is complicated to fix, and the shape of the transducer is high.

Method used

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  • Preparation method of underwater acoustic transducer shielding layer
  • Preparation method of underwater acoustic transducer shielding layer
  • Preparation method of underwater acoustic transducer shielding layer

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preparation example Construction

[0031] Such as Figure 4 As shown, the preparation method of the underwater acoustic transducer shielding layer provided by the present invention includes:

[0032] Step 1. Pouring a layer of polyurethane glue on the surface of the underwater acoustic transducer wafer, and curing it in an oven at 80°C;

[0033] Step 2. Install screws and soldering tabs on the metal shell, and lead a bare wire from the soldering tab on the metal shell of the transducer;

[0034] Step 3. Put the welded underwater acoustic transducer into the oven to preheat;

[0035] Step 4, using chemical reagents to treat the polyurethane on the surface of the preheated transducer;

[0036] Step 5. Apply a layer of conductive adhesive evenly on the surface of polyurethane, connect the conductive adhesive to the shell with bare wires, and put it in an oven to cure;

[0037] Step 6, performing surface treatment on the cured conductive adhesive layer;

[0038] Among them, the transducer potting polyurethane g...

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Abstract

The invention provides a preparation method of an underwater acoustic transducer shielding layer, which comprises the following steps of: encapsulating a layer of polyurethane adhesive on the surfaceof a wafer of the underwater acoustic transducer wafer, and curing in an oven at the temperature of 80 DEG C; installing a screw and a soldering lug on the metal shell, and leading a bare wire out from the soldering lug on the metal shell of the transducer; putting the welded underwater acoustic transducer into a drying oven to be preheated; treating the preheated polyurethane on the surface of the transducer by using a chemical reagent; uniformly coating a layer of conductive adhesive on the surface of the polyurethane, communicating the conductive adhesive with the shell by using a bare conductor, and curing in an oven; and carrying out surface treatment on the cured conductive adhesive layer. According to the method, a simple and efficient underwater acoustic transducer shielding layercan be provided, the operation is simple, bubbles are not generated, the influence on the acoustic performance of the transducer is small, and the manufactured underwater acoustic transducer shieldinglayer is good in shielding performance and high in reliability, is not limited by a structure fixing mode, and can adapt to transducers of any shape.

Description

technical field [0001] The invention relates to the technical field of underwater acoustic engineering, in particular to a method for preparing a shielding layer of an underwater acoustic transducer. Background technique [0002] In electronic equipment, electromagnetic interference energy is generally transmitted in two ways: conductive coupling and radiative coupling. In order to meet the requirements of electromagnetic compatibility, the conductive coupling needs to be suppressed by using filtering technology, that is, the EMI filter device is used to suppress it; the radiative coupling needs to be suppressed by shielding technology. In the current situation where the electromagnetic spectrum is becoming increasingly dense, the electromagnetic power density per unit volume is increasing sharply, and a large number of high- and low-level devices or equipment are used in combination, the electromagnetic environment of equipment and systems is deteriorating, and its importan...

Claims

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Application Information

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IPC IPC(8): H04R31/00
CPCH04R31/00H04R2231/003
Inventor 陈庆瑞胡健辉王敏慧欧阳荀刘佳李科
Owner 上海船舶电子设备研究所
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