Transition device for flexible device, preparation method and method for patching flexible device

Abstract

A transition device for a flexible device, a preparation method and a method for patching a flexible device, the transition device includes a flexible device based on a polymer substrate and a transition substrate, and the flexible device based on a polymer substrate includes a substrate layer and a device functional layer and an encapsulation layer, the device functional layer is arranged on the substrate layer, the encapsulation layer encapsulates the device functional layer, and the flexible device based on the polymer substrate is formed with a preparatory and substrate-mounting process. The first surface of the first surface, and the second surface corresponding to the first surface, the transition substrate is bonded to the second surface of the flexible device based on the polymer substrate through an adhesive layer. The transition device of the flexible device can easily carry out patch processing on the flexible device based on the polymer substrate, which is convenient for mass production of devices with the same specification parameters, and can make the transition device of the flexible device directly used in the manufacture of flexible electronic products In the process, it is conducive to the development of the flexible electronic product industry.

Description

technical field [0001] The invention relates to the field of chip packaging, in particular to a transition device for flexible devices, a method for preparing the transition device, and a method for bonding flexible devices based on the transition device for flexible devices. Background technique [0002] In recent years, with the continuous development and progress of flexible electronics technology and the increasingly widespread application of smart wearable products, flexible electronic devices are very popular in the market due to their unique advantages of flexibility, ductility, light weight, and thin thickness. Broad application prospects. [0003] Functional components are the key to the composition of flexible electronic products. Functional components include IC chips based on semiconductor materials such as Si, SiC, and GaAs, and polymer-based polymer substrates such as resistors, capacitors, sensors, and biological MEMS. substrate for flexible devices. Flexibl...

AI Technical Summary

Problems solved by technology

This kind of manufacturing technology is not compatible with the existing integrated manufacturing technology and equipment of electronic products. The equipment required for printing or printing technology is complicated and the cost is high, which is not conducive to the development of the flexible electronic product industry.

[0004] In addition, this manufacturing method is not conducive to the screening of devices. If there is a problem with a flexible device based on a polymer substrate, it will affect the function of the entire flexible electronic product. The replacement has a serious impact on the yield of the product

[0005] Finally, in the manufacturing process of flexible electronic products, the placement of IC chips and flexible devices based on polymer substrates requires two completely different sets of equipment, which increases production costs

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