Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Intelligent edge sealing setting method for PCB

A technology of PCB board and edge sealing, applied in the field of intelligent edge sealing setting of PCB board, can solve the problems of insufficient intelligent edge sealing, high product defect rate, low efficiency, etc., to improve work efficiency and accuracy, save moving distance and time, the effect of improving production efficiency

Active Publication Date: 2019-11-22
QINGYUAN FUYING ELECTRONICS
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the edge banding of the PCB board is not handled well, it is easy to expose the edge of the board, and it will be corroded by strong acid and strong alkali solution. On the one hand, it will have a great adverse effect on product quality, affect the electrical characteristics of the product, and cause a high defect rate of the product.
The existing edge banding is not intelligent enough, resulting in low efficiency

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0049] In order to further understand the features, technical means and specific objectives and functions achieved by the present invention, the present invention will be further described in detail below in conjunction with specific embodiments.

[0050] The invention discloses a method for setting intelligent edge banding of a PCB board, comprising the following steps:

[0051] S1, edge banding of the outer layer circuit and generate CCD film, generate positive outer layer positive film or negative process film according to the set requirements, then lay copper sheet and copper block on the outer layer PANL edge banding, automatically add graphic symbols, and generate outer layer circuit CCD alignment film, the graphic symbols include alignment hole PAD, CCD alignment PAD, variegated ink alignment PAD and other graphic symbols, intelligently adjust the positions of various graphic symbols to ensure their position consistency and accuracy.

[0052] S2, edge banding of the inn...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an intelligent edge sealing setting method for a PCB. The intelligent edge sealing setting method comprises the following steps of: sealing an outer-layer circuit, generating aCCD film inner-layer circuit sealing edge and generating a CCD film; sealing the edge of a solder mask layer and generating a CCD film; sealing edges of a character layer and generating a CCD film; performing drilling, automatically adding tool holes which comprise a target hole, a CCD alignment hole, a rivet hole, a material number hole and a tail hole, adding and changing various auxiliary holes, finally optimizing a drilling belt, and adjusting the moving distance and time of a drilling machine; generating various auxiliary layers including a gear point, a plug hole and a V-CUT layer; andperforming storage, namely storing the set data information, and directly carrying out intelligent automatic edge sealing processing on the PCB according to the steps S1-S6. Automatic processing is achieved, and the working efficiency and accuracy of personnel are greatly improved. The drilling belt is optimized, the drilling machine moving distance and time are saved, the manufacturing cost is reduced, and the production efficiency is improved.

Description

technical field [0001] The invention belongs to the technical field of PCB board processing, in particular to a method for setting intelligent edge banding of a PCB board. Background technique [0002] During the processing of PCB boards, edge banding is one of the processes. The edge banding treatment is to not spread copper on the side of the PCB board, and the edge banding distance is usually the distance between the copper on the PCB board and the edge of the board. If the edge sealing of the PCB board is not handled well, it is easy to expose the edge of the board and be corroded by strong acid and strong alkali. On the one hand, it has a great adverse effect on product quality, affects the electrical characteristics of the product, and has a high defect rate. . The existing edge banding is not intelligent enough, resulting in low efficiency. Contents of the invention [0003] In order to solve the above technical problems, the present invention provides a method f...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K3/00
CPCH05K3/0005Y02P90/30
Inventor 林驰
Owner QINGYUAN FUYING ELECTRONICS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com