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Interpenetrating network hydrogel material with high thermal conductivity and high elasticity, and preparation method thereof

A technology of interpenetrating network and hydrogel, which is applied in the field of high thermal conductivity and high elasticity interpenetrating network hydrogel material and its preparation, can solve the problems of mechanical strength decline, increase thermal conductivity, improve compressive performance, and composite process simple effect

Inactive Publication Date: 2019-11-15
SHANGHAI SECOND POLYTECHNIC UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Hydrogel is a new type of polymer material with a three-dimensional network structure. It has broad application prospects in the fields of industry, agriculture, biomedicine, enzyme immobilization, and drug release. However, most traditional hydrogels have low water content. It has certain mechanical properties when the water content is high, but the mechanical strength decreases significantly when the water content is high. In recent years, in order to improve the mechanical properties of hydrogels, domestic and foreign scholars have conducted a lot of research and developed a series of new types with high strength. Hydrogel system with high toughness

Method used

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  • Interpenetrating network hydrogel material with high thermal conductivity and high elasticity, and preparation method thereof
  • Interpenetrating network hydrogel material with high thermal conductivity and high elasticity, and preparation method thereof

Examples

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Effect test

Embodiment 1

[0024] Weigh 1g of hydroxyethyl cellulose and dissolve it in 20ml of deionized water, stir well, add 4g of acrylic acid, then add 0.3g of ammonium persulfate, stir well, pour it into the mold quickly, and place it in an oven with a temperature of 60°C , Reaction 2h.

Embodiment 2

[0026] Weigh 2g of hydroxyethyl cellulose and dissolve it in 20ml of deionized water, stir well, add 4g of acrylic acid, then add 0.3g of ammonium persulfate, stir well, pour it into the mold quickly, and place it in an oven with a temperature of 60°C , Reaction 2h.

Embodiment 3

[0028] Weigh 3g of hydroxyethyl cellulose and dissolve it in 20ml of deionized water, stir well, add 4g of acrylic acid, then add 0.3g of ammonium persulfate, stir well, pour it into the mold quickly, and place it in an oven with a temperature of 60°C , Reaction 2h.

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Abstract

The invention discloses an interpenetrating network hydrogel material with a high thermal conductivity and a high elasticity, and a preparation method thereof. The preparation method comprises the following steps: hydroxyethyl cellulose is taken, and is dissolved in a graphene oxide / ammonium persulfate suspension, stirring is performed until uniformity, an appropriate amount of acrylic acid is added, then the obtained mixed solution is rapidly poured into a mold, the mold is placed in a constant temperature oven, the mixed solution is reacted for a period of reaction, and the obtained hydrogelin the mold is taken out, and is washed with deionized water to remove unreacted monomers and impurities in order to obtain the hydrogel containing a small amount of graphene oxide. The method of theinvention has a simple process, the obtained hydrogel has good compression resistance and good thermal conductivity, and the high thermal conductivity can be achieved by adding only a small amount ofthe graphene oxide; and compared with other thermal conducting media, the interpenetrating network hydrogel material of the invention has the excellent characteristics of good compressive strength, reusability, no oil permeation, low viscosity, and easiness in disassembling.

Description

technical field [0001] The invention relates to the technical field of heat-conducting media, in particular to a highly heat-conducting and highly elastic interpenetrating network hydrogel material and a preparation method thereof. Background technique [0002] With the development of electronic equipment towards high integration and miniaturization, if there is no good heat dissipation, the service life of electronic components will be reduced or the overall performance of electronic equipment will be affected. According to statistics [Zhou Wenying, Qi Shuhua, et al. Adhesive Research [J]. Materials Herald, 2005, 19(5):26-29.], every time the temperature of electronic components increases by 2°C, the reliability of the whole machine will decrease by 10%, and the temperature of electronic components will be reduced by means of heat dissipation At 10 ℃, the service life of the whole machine can be doubled, so the demand for researching materials with good thermal conductivity...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J3/075C08L51/02C08K3/04C08F251/02C08F220/06C09K5/10
CPCC08F251/02C08J3/075C08J2351/02C09K5/10C08K3/042C08F220/06
Inventor 于伟邴乃慈包志杰陈程杨杰王德兵
Owner SHANGHAI SECOND POLYTECHNIC UNIVERSITY
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