Manufacturing method of multilayer substrate and multilayer substrate

Abstract

The invention discloses a manufacturing method of a multilayer substrate. The method comprises the following steps of: the step 1, providing an insulating substrate; the step 2, covering an insulatingfilm on the surface of the insulating substrate; the step 3, manufacturing at least one hole part on the basis; the step 4, filling conductive slurry in at least one hole part, and solidifying the conductive slurry filled in the at least one hole part; the step 5, removing the insulating film, and exposing the cured at least one conductive slurry on the surface of the insulating substrate to format least one interlayer connection conductor; the step 6, attaching a conductive foil layer on the at least one surface of the insulating substrate, and performing laminating for bonding; the step 7,etching at least one of the conductive foil layers to form a predetermined conductive pattern; and the step 8, repeating the above steps 1-7 for many times, and finally performing laminating to forma multi-layer substrate. The invention provides a multilayer substrate manufactured by the method.

Description

technical field [0001] The invention relates to a method for manufacturing a multilayer substrate and a multilayer substrate manufactured by the method. Background technique [0002] Recently, a large number of various multilayer substrates have been popularized, and a multilayer substrate formed of a plurality of insulating base layers forming conductive patterns is known (for example, refer to Patent Document 1). [0003] In the multilayer substrate of Patent Document 1, a conductor is patterned on an insulating base layer, and the electrical interlayer connection of each layer is performed through an interlayer connection conductor. [0004] prior art literature [0005] patent documents [0006] Patent Document 1: Chinese Patent Publication No. CN206698489U. [0007] However, the interlayer connection conductor in Patent Document 1 must consider the adhesion to the plane conductive pattern layer, and it is necessary to add additional plated bumps on the copper surface...

AI Technical Summary

Problems solved by technology

Therefore, its manufacturing process is bound to be complex and inefficient, and due to the high requirements on the manufacturing process and equipment, the effect of interlayer conductivity and signal transmission may not be ideal.

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