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High-precision ultrathin sheet overlapping, stacking and connecting machine and overlapping and connecting method thereof

A connection method and ultra-thin sheet technology, which are applied in multilayer circuit manufacturing, electrical components, printed circuit manufacturing, etc., to achieve the effects of reducing material loss, improving adjustment efficiency, and ensuring yield

Pending Publication Date: 2019-10-18
JIANGSU XINTIMU INTELLIGENT EQUIP CO LTD +1
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  • Abstract
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  • Claims
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Problems solved by technology

[0004] Since it is necessary to stack and connect multiple layers of ultra-thin sheets into one body, how to ensure that the alignment of each layer of sheets is completely accurate during connection to ensure that the final product meets the requirements has become an urgent problem to be solved, and there is no such thing on the market. Equipment that can effectively ensure the position accuracy of multi-layer sheets

Method used

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  • High-precision ultrathin sheet overlapping, stacking and connecting machine and overlapping and connecting method thereof
  • High-precision ultrathin sheet overlapping, stacking and connecting machine and overlapping and connecting method thereof
  • High-precision ultrathin sheet overlapping, stacking and connecting machine and overlapping and connecting method thereof

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Embodiment Construction

[0050] Objects, advantages and features of the present invention will be illustrated and explained by the following non-limiting description of preferred embodiments. These embodiments are only typical examples of applying the technical solutions of the present invention, and all technical solutions formed by adopting equivalent replacements or equivalent transformations fall within the protection scope of the present invention.

[0051] In the description of the scheme, it should be noted that the terms "center", "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", " The orientation or positional relationship indicated by "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of description and simplification of description, rather than indicating or implying that the device or element referred to must have a specific orientation , constructed and operated in a particular or...

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Abstract

The invention discloses a high-precision ultrathin sheet overlapping, stacking and connecting machine and an overlapping and connecting method thereof. The high-precision ultrathin sheet overlapping and connecting machine comprises a first sheet positioning jig, a second sheet positioning jig, a third sheet positioning jig, a first transferring device and a second transferring device. According tothe scheme, a fixed positioning pin and a movable positioning pin are respectively arranged on the plurality of jigs, so that the movable positioning pin is connected with a micrometer, the positionof the movable positioning pin can be accurately determined through the micrometer, and the position precision of the movable positioning pin is greatly ensured; meanwhile, during the subsequent adjustment of the movable positioning pin, the adjustment can be carried out by referring to micrometer data of a previous jig, thereby facilitating the improvement of the adjustment efficiency of the movable positioning pin, or the adjustment of the movable positioning pins of the jigs. Therefore, the mutual verification can be carried out through micrometer data of the positioning jigs, and a technical guarantee is provided for overlapping and stacking of multiple layers of materials.

Description

technical field [0001] The invention relates to lamination equipment, in particular to a high-precision superthin sheet overlapping and connecting machine and a laminating and connecting method thereof. Background technique [0002] The main function of PCB lamination is to laminate the inner layer board, PP film, and copper foil in a certain order, and then bond them together through high temperature and high pressure to make it a four-layer board or multi-layer board. When the PP film bonds the inner board and the copper foil through high temperature and high pressure, for example, in the field of soft and hard bonded board manufacturing, there are PP films with the same window shape and size and a thickness of tens of microns that are laminated and connected with FCCL. Together, this operation method requires 4 people to operate manually, of which 2 people clean the PP film (to avoid PP powder residue and cause defects), and 1 person needs to use PIN nails to connect the ...

Claims

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Application Information

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IPC IPC(8): H05K3/46
CPCH05K3/4638H05K2203/068
Inventor 林睦群王炜谭敏
Owner JIANGSU XINTIMU INTELLIGENT EQUIP CO LTD
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