Micro LED huge transfer device and method based on addressable electromagnetic array

Abstract

The invention belongs to the technical field of huge transfer, and particularly discloses a Micro LED huge transfer device and method based on an addressable electromagnetic array; the huge transfer device comprises an upper computer, a driving module array and a circuit module, wherein the driving module array is composed of a plurality of driving modules which are distributed in an array mode; an upper electrode and a lower electrode are arranged on each driving module, and an electrified electromagnet is arranged between the upper electrode and the lower electrode; the circuit module is connected with the upper computer and the driving modules separately, and is used for realizing independent control on the electric property of the electric charges of the upper electrode and the lower electrode of each driving module according to the control instruction of the upper computer, so that the magnetic force between the electrified electromagnet and the magnetic Micro LED can be changed,and the Micro LED can be picked and released. The method comprises the following steps of transferring the Micro LED to an intermediate carrier substrate; and transferring the Micro LED to a target circuit substrate by means of the device. The method disclosed by the invention can realize the patterning of the Micro LED and the selective huge transfer, and has the advantages of being convenient tooperate, high in applicability and the like.

Description

technical field [0001] The invention belongs to the technical field of mass transfer, and more specifically relates to a Micro LED mass transfer device and method based on an addressable electromagnetic array. Background technique [0002] In recent years, the manufacturing process of Micro LEDs (μLEDs) has become more and more perfect. Compared with traditional display panels, Micro LEDs have smaller size, higher resolution, higher brightness, higher luminous efficiency, and lower power consumption. And many other advantages, so it is also considered to be the mainstream of the next generation display technology. [0003] Usually, the manufacturing process of light-emitting diodes is to firstly thin the diode (LED) structure into a thin film, miniaturize, and array it so that its size is only about 10-20 microns, then transfer the micro-light-emitting diodes to the display circuit substrate in batches, and finally carry out encapsulation. Among them, how to realize batch ...

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Problems solved by technology

[0004] At present, the mass transfer technology that can realize selective transfer mainly includes the following types: One is to realize selective transfer by making molds. This method positions micro LEDs by making left and right asymmetrical micro holes on the mold. The place where the LED is received on the circuit substrate, and vice versa, it is not received. This method requires the shape of the micro-LED to be consistent with the shape of the hole, which increases the difficulty of making the micro-LED and the mold; the second is to realize the selection through fluid self-assembly Sexual transfer, this method puts the micro-LEDs with magnetic poles and the circuit substrate into a specific solution, and is positioned by magnetic force, and the micro-light-emitting diodes positioned by the magnetic force are received, otherwise they are not received. and inaccurate positioning

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