Display mother board, preparation method thereof and electroluminescence display panels

Abstract

The invention discloses a display mother board, a preparation method thereof and electroluminescence display panels, so as to prevent a sealant from flowing to a cutting area and ensure the display product preparation yield. The display mother board provided by the embodiment of the invention comprises a display substrate and a cover plate which are arranged oppositely. The display mother board is divided to a display panel area and a peripheral area surrounding the display panel area; the display panel area comprises multiple electroluminescence display panels; the peripheral area comprises a cutting area and a packaging area surrounding the cutting area; and the packaging area comprises the sealant sealing the display substrate and the cover plate and surrounding the cutting area and a sealant blocking structure located at one side, facing the cutting area, of the sealant.

Description

technical field [0001] The present application relates to the field of display technology, in particular to a display motherboard, a preparation method thereof, and an electroluminescence display panel. Background technique [0002] Organic Light Emitting Diode (OLED) display devices have self-illumination, low driving voltage, high luminous efficiency, short response time, high definition and contrast, viewing angle of nearly 180°, wide operating temperature range, and can realize flexible display and With many advantages such as large-area full-color display, it is recognized by the industry as a display device with the most potential for development. [0003] When making OLED display products, encapsulation process is required. One of the encapsulation methods is: apply glass glue (Frit glue) on the cover glass and attach it to the back glass, but the Frit glue will be textured after curing and before the laser process. Hard and non-adhesive to the backplane glass; there...

AI Technical Summary

Problems solved by technology

However, due to the adhesiveness of UV glue, its texture is relatively soft. In the process of vacuum bonding the cover glass and the back glass into the atmospheric pressure, such as image 3 As shown, the atmospheric pressure makes the UV glue 1 flow from the edge area along the inside of the glass to form a puncture shape 5, and the UV glue 1 exists in the area corresponding to the cutting line 3, which affects the subsequent cutting and causes the panel to be damaged

[0004] In summary, the packaging process of OLED display products in the prior art is prone to UV glue puncture, which affects the subsequent cutting process, causes cutting damage, and affects the production yield of OLED display products.

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