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Display panel and preparation method thereof

A technology for display panels and slopes, which is applied in the field of display panels and their preparation, can solve problems such as reducing the screen ratio of display panels, and achieve the effects of improving market competitiveness, small frame width, and increasing screen ratio

Active Publication Date: 2019-09-24
WUHAN CHINA STAR OPTOELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the integrated circuit (IC) bonding area is saved, space needs to be reserved for the anisotropic conductive adhesive, which greatly reduces the screen-to-body ratio of the display panel

Method used

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  • Display panel and preparation method thereof
  • Display panel and preparation method thereof
  • Display panel and preparation method thereof

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Embodiment Construction

[0033] The preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, to fully introduce the technical content of the present invention to those skilled in the art, to prove that the present invention can be implemented, to make the technical content disclosed in the present invention clearer, and to make the technical content of the present invention clearer. It is easier for those skilled in the art to understand how to implement the present invention. However, the present invention can be realized through many different forms of embodiments, and the scope of protection of the present invention is not limited to the embodiments mentioned herein, and the descriptions of the following embodiments are not intended to limit the scope of the present invention.

[0034] The directional terms mentioned in the present invention, such as "up", "down", "front", "back", "left", "right", "inside", "outside", "side", etc...

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Abstract

The invention provides a display panel and a preparation method thereof. The display panel comprises an array substrate, a color film substrate and a chip-on-film; a first oblique face is arranged at the edge of one side of the array substrate; the color film substrate is arranged on the surface of one side of the array substrate; a second oblique face is arranged at the edge of one side of the color film substrate and is in the same plane together with the first oblique face; and the chip-on-film is bound to the first oblique face and the second oblique face. The preparation method of the display panel comprises the following steps: providing of the array substrate, arranging of the color film substrate, cutting and binding. The display panel and the preparation method thereof have the technical effects that the thickness of a lower frame of the display panel is decreased, and the screen-to-body ratio is increased.

Description

technical field [0001] The invention relates to the field of displays, in particular to a display panel and a preparation method thereof. Background technique [0002] In recent years, low temperature polysilicon (Low Temperature Poly-Silicon, LTPS) display screens have been more and more used in high-end small-size products. LTPS display screens have high resolution, high aperture ratio, high response speed, and low power consumption. Advantages, in order to increase the screen-to-body ratio of the panel at this stage, many new technologies have been derived, such as narrow bezels, Chip On Flex / Chip On Film (COF), special-shaped displays, etc. [0003] These currently known techniques have their own limitations: [0004] The narrow frame mainly compresses the left and right upper frames by cutting and sealing (Cut on seal). [0005] Chip-on-chip film (COF) is integrated on a flexible printed circuit board (Flexible Printed Circuit Board, FPC), and the COF is bonded to TFT...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G09F9/00
CPCG09F9/00
Inventor 马荣刘广辉
Owner WUHAN CHINA STAR OPTOELECTRONICS TECH CO LTD
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