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Temperature detection module, array substrate and display device

An array substrate and module technology, which is applied in the directions of measuring devices, thermometers, thermometer parts, etc., can solve the problems of complex structure, increase the difficulty and cost of manufacturing display devices, etc. simple effect

Active Publication Date: 2019-09-20
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the structure of traditional temperature detectors is relatively complicated, such as thermocouple thermometers, thermal resistance thermometers, etc. If they are integrated in the display device, the difficulty and cost of manufacturing the display device will be greatly increased.

Method used

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  • Temperature detection module, array substrate and display device
  • Temperature detection module, array substrate and display device
  • Temperature detection module, array substrate and display device

Examples

Experimental program
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Embodiment Construction

[0042] Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments, however, can be embodied in various forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this application will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus their detailed descriptions will be omitted.

[0043] Although relative terms such as "upper" and "lower" are used in this specification to describe the relative relationship of one component of an icon to another component, these terms are used in this specification only for convenience, such as according to the direction of the example described. It will be appreciated that if the device of the icon is turned upside down, the components described as "on" will become...

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PUM

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Abstract

The application relates to the technical field of display, particularly, relates to a temperature detection module, array substrate and display device. The temperature detection module can include: a first transparent substrate; a heat conduction substrate provided with a first surface and a second surface which are opposite, wherein the first surface faces the first transparent substrate, and the second surface deviates from the first transparent substrate and can be in contact with a component to be tested; a first phase transition layer positioned between the first transparent substrate and the heat conduction substrate and formed on the first surface; a reflective layer formed on the surface of the first phase transition layer facing the first transparent substrate, and having an air gap with the first transparent substrate; and a connecting structure connected with the heat conduction substrate and the first transparent substrate and arranged around the first phase transition layer and the reflective layer, wherein the heat conduction substrate can conduct heat of the component to be tested to the first phase transition layer, and the first phase transition layer can contract or expand at different temperatures so as to change the size of the air gap. The scheme has simple manufacturing process and lower cost.

Description

technical field [0001] The present application relates to the field of display technology, and in particular, to a temperature detection module, an array substrate and a display device. Background technique [0002] With the continuous popularization of display devices such as mobile phones, watches, and wristbands, users have higher and higher requirements for them. They need not only display and call functions, but also other functions, such as temperature detection functions. However, traditional temperature detectors have complex structures, such as thermocouple thermometers, thermal resistance thermometers, etc. If they are integrated into the display device, the manufacturing difficulty and cost of the display device will be greatly increased. [0003] It should be noted that the information disclosed in the above Background section is only for enhancing understanding of the background of the application, and therefore may include information that does not form the pri...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01K5/70G01K1/02G01K5/58H01L27/12
CPCG01K5/70G01K1/024G01K5/58H01L27/1222
Inventor 卜倩倩杨虹孙晓胡伟频魏从从
Owner BOE TECH GRP CO LTD
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