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Array substrate, display device

A technology for array substrates and display areas, applied in the fields of array substrates and display devices, can solve the problems of high lap resistance between driver chips and binding parts, and achieve the effect of avoiding damage

Active Publication Date: 2022-04-22
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Embodiments of the present invention provide an array substrate and a display device, which are used to solve the problem of relatively large lap resistance between the driver chip and the binding part

Method used

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  • Array substrate, display device
  • Array substrate, display device
  • Array substrate, display device

Examples

Experimental program
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Effect test

example 1

[0143] Since the second insulating layer 24 covers less of the part of the binding part 23 located in the signal transition area C1 , the bonding area of ​​the binding part 23 and the driving circuit is larger, and the bonding resistance is smaller.

[0144] The array substrate 1011 includes at least one signal lead 21 , and the signal lead 21 is disposed on the substrate 20 and at least located in the signal transmission area C2.

[0145] The first insulating layer 22 is disposed on the side away from the signal wire leads away from the substrate 20 ; at least one first via hole 221 is disposed on the first insulating layer 22 .

[0146] At least one binding part 23 is arranged on the side of the first insulating layer 22 away from the substrate 20, and each binding part 23 is electrically connected to a signal line lead through the first via hole 221; Contact area C1.

[0147] The second insulating layer 24 is disposed on the surface of the bonding portion 23 away from the ...

example 2

[0168] Such as Figure 13 As shown, the array substrate 1011 includes at least one signal lead 21, and the signal lead 21 is disposed on the substrate 20 and at least located in the signal transmission area C2.

[0169] The first insulating layer 22 is disposed on the side away from the signal wire leads away from the substrate 20; at least one first via hole 221 is disposed on the first insulating layer 22, and the first via hole 221 is located in the signal transmission area C2.

[0170] At least one binding part 23 is arranged on the side of the first insulating layer 22 away from the substrate 20, and each binding part 23 is electrically connected to a signal line lead through the first via hole 221; the binding part 23 is located at the signal transition area C1 and extends to the signal transmission area C2.

[0171] The second insulating layer 24 is disposed on the surface of the bonding portion 23 away from the substrate 20 , and the second insulating layer 24 covers ...

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Abstract

The invention provides an array substrate and a display device, which relate to the field of display technology and are used to solve the problem of relatively large lap resistance between a driving chip and a binding part. The array substrate includes: a substrate; at least one signal lead, the signal lead is arranged on the substrate and at least located in the signal transmission area; a first insulating layer is arranged on the side away from the signal lead from the substrate; the first insulating layer is provided with At least one first via hole; at least one binding part is arranged on the side of the first insulating layer away from the substrate, and each binding part is electrically connected to a signal line lead through the first via hole; the binding part is at least located on the signal line Transition area; the second insulating layer is arranged on the surface of the binding part away from the substrate, the orthographic projection of the second insulating layer on the substrate is located within the orthographic projection of the binding part on the substrate, and the second insulating layer covers The part of the bonding part that is electrically connected to the signal lead.

Description

technical field [0001] The present invention relates to the field of display technology, in particular to an array substrate and a display device. Background technique [0002] The array substrate is an integral part of the display device, and the array substrate generally includes a display area and a binding area disposed on one side of the display area. [0003] The display area is used to set a plurality of pixel circuits arranged in an array, and the binding area is used to realize the binding between the pixel circuits on the array substrate and the driving chip, so as to realize the signal transmission between the driving chip and the pixel circuit. [0004] The binding area includes a signal transmission area and a signal transition area. The signal transmission area is provided with signal leads, and the signal transfer area is provided with a binding part. The signal leads are connected to the binding part correspondingly, and the array substrate and the driver chi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/12G02F1/1362G02F1/1368H01L27/32
CPCH01L27/124H01L27/1248G02F1/136286G02F1/1368H10K59/1315
Inventor 孙世成郭钟旭张伟王培司晓文李存智
Owner BOE TECH GRP CO LTD
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