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Microsphere probe preparation method based on micro-cantilever transfer

A micro-cantilever and probe technology, which is applied in the photoengraving process, manufacturing tools, welding equipment and other directions of the pattern surface, can solve the problems of high price, easy fork of the needle tip, single probe material, etc., and reduce the loading error. , the effect of increasing the loading range and increasing the contact area

Active Publication Date: 2019-08-23
SOUTHWEST JIAOTONG UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The preparation method of probes has attracted much attention as a prerequisite for the application of probe technology, but the preparation of large-size (hundred micron) microsphere probes has not been extensively studied.
Large-size (hundred-micron-scale) microsphere probes can be used for mesoscopic micro-nano processing. At present, the probe materials used in this scale processing are relatively single, mostly diamond materials, and the preparation is difficult and expensive; and Due to the high brittleness of diamond, the needle tip is easily bifurcated during processing, which seriously restricts micro-nano processing at the mesoscopic scale.

Method used

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  • Microsphere probe preparation method based on micro-cantilever transfer
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  • Microsphere probe preparation method based on micro-cantilever transfer

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Embodiment Construction

[0025] Embodiments of the present invention will be further described below in conjunction with the accompanying drawings.

[0026] see figure 1 , a method for preparing microsphere probes based on microcantilever transfer, realized by the following steps:

[0027] S1. Place the microspheres and the adhesive on the first preset area and the second preset area of ​​the silicon wafer respectively, and place the silicon wafer on the sample stage.

[0028] In this embodiment, microspheres of appropriate material and size are selected according to requirements, placed on a predetermined microsphere placement area on the silicon wafer, and the adhesive is placed on another predetermined area on the silicon wafer.

[0029] In this embodiment, the material of the microspheres is not particularly limited, and the size can be changed in a large gradient range from nanometers to millimeters, and the best effect is especially when the radius of curvature is in the range of 50-500 μm. Pr...

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Abstract

The invention provides a microsphere probe preparation method based on micro-cantilever transfer, and belongs to the technical field of micro-nano manufacturing. The preparation method is simple in process and low in cost, and can be used for preparing the microsphere probe for testing micro-nano processing or indentation mechanical properties and the like; flexible bonding of any granular material can be realized, and any granular material can be randomly matched with any receptor platform; the cantilever can serve as a transfer layer while transferring the microspheres, so that the contact area of the microspheres and the receptor platform is increased, and the contact pressure is further reduced to reduce the deformation of the receptor platform; accurate positioning of the microspheresat the tip of the receptor in the probe preparation process can be achieved through the micro-cantilever, and the situation that the small-size microspheres are completely soaked into glue and pollute the surface of the microsphere probe in the bonding process can be avoided.

Description

technical field [0001] The invention belongs to the technical field of micro-nano manufacturing, and in particular relates to a method for preparing microsphere probes based on microcantilever transfer. Background technique [0002] With the wide application of micro-nano-sized components in various fields such as MEMS, IC, and optical devices, micro-nano processing methods and technologies are also facing great challenges while making great progress. Carrying out research on micro-nano-scale processing methods is of great significance not only for the development of advanced manufacturing technology, but also for my country to maintain a favorable position in the new round of scientific and technological competition. In recent years, due to the advantages of high flexibility and high precision, probe technology has gradually been widely used in the field of micro-nano processing. Probe technology is to achieve material removal, oxide layer growth, texture processing and ot...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81C3/00
CPCB81C3/001
Inventor 陈磊石鹏飞钱林茂郭杰陈超肖晨晏文孟
Owner SOUTHWEST JIAOTONG UNIV
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