Method and system for inspecting wafer defects

Abstract

The invention relates to a method and system for inspecting wafer defects. The method comprises the steps that a PC scans the barcode of a wafer to be inspected to acquire wafer information, and generates a wafer MAP simulated diagram according to the acquired wafer information; a wafer conveying module conveys the wafer to be inspected to a wafer positioning module; the wafer positioning module performs notch angular positioning on the wafer to be inspected and adjusts the X-axis and Y-axis placement central positions, and the wafer conveying module conveys the wafer to be inspected to a carrier of an OM inspection module; the OM inspection module obtains the defect picture and the defect coordinates of the wafer to be inspected, and a communication module transmits the acquired defect picture and defect coordinates to the PC; the PC integrates the received defect picture and defect coordinates into the wafer MAP simulated diagram to generate a marked MAP of the wafer. The mark on themarked MAP of the wafer accurately indicates the location of defect on the wafer, facilitates analysis of defects in each layer of the wafer, provides a high degree of visualization, and can quicklyreview the defect pictures at the defect location.

Description

technical field [0001] The invention relates to the technical field of wafer inspection, in particular to a method and system for inspecting wafer defects. Background technique [0002] Wafers are the basic material for manufacturing semiconductor chips. When wafers are processed in different processes, it is necessary to inspect wafers for defects. In the existing inspection of the wafer, it is usually inspected by OM (Optical Microscopy, optical microscope). When a defect is found through inspection, the photo is taken and saved in a local file, which is not easy to find and inspect, and is easy to lose; and OM obtains The photos cannot accurately record the location of the defect on the wafer, and there are certain difficulties in the later traceability and analysis of the defect. Contents of the invention [0003] To this end, it is necessary to provide a method and system for inspecting wafer defects, so as to solve the problem that existing wafer defects obtained t...

AI Technical Summary

Problems solved by technology

[0003] To this end, it is necessary to provide a method and system for inspecting wafer defects to solve the problem that existing wafer defects obtained through OM cannot accurately record the location of defects on the wafer

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