A calculation method for the maximum temperature of the shell of a power chip

Abstract

The present invention provides a method for calculating the maximum temperature of the outer shell of a power chip, comprising: step S1, providing a test environment, and setting a temperature measuring device in the heat sink under the test environment; step S2, calculating the temperature of the power chip in the first power mode The first power consumption, and the temperature measuring device measures the first temperature corresponding to the first power consumption, and calculates the second power consumption of the power chip in the second power mode, and the temperature measuring device measures the temperature corresponding to the second power consumption The second temperature; step S3, according to the difference between the first temperature and the second temperature, the first power consumption and the second power consumption according to the first formula to calculate the thermal resistance of the heat sink; step S4, according to the heat value and the maximum consumption The power is calculated according to the second formula to obtain the maximum temperature of the casing of the power chip. The invention has the beneficial effects of saving estimation time, improving production efficiency and reducing production cost.

Description

technical field [0001] The invention relates to the field of chip technology, in particular to a method for calculating the maximum temperature of a power chip shell. Background technique [0002] In order to ensure the stable operation of the system, the current electronic equipment usually cools down the chips with relatively large power consumption (such as SOC main chip, PowerIC, etc.) The use of will increase the risk of system stability, so how to quickly estimate the thermal resistance of the heat sink has become an urgent problem to be solved. [0003] In the prior art, the following two methods are used to calculate the heat sink: [0004] Method 1: Use simulation tools to simulate and calculate the thermal resistance of the heat sink required by the power chip. However, the simulation calculation needs to collect various influencing parameters, and the entire simulation calculation process is cumbersome, time-consuming and laborious; especially for multiple produc...

AI Technical Summary

Problems solved by technology

[0008] Problem 1, the accuracy of the calculated maximum temperature of the chip shell is poor. The reason is that the TCmax value calculated in the standard rule (spec) is obtained by simulation calculation on a standard PCB board and a standard laboratory environment, but There are not small differences in the PCB size of the main board in the actual application and the heat dissipation environment of the actual product structure, which leads to errors in the calculated TCmax value;

[0009] The second problem is that the test position of the chip has not been determined, and the test position of the chip will lead to different TCmax values. For example, the edge temperature of the chip is generally lower than the center point temperature

[0010] Therefore, the above method can avoid the above problems by increasing the derating margin (that is, increasing the size of the heat sink, the margin will be increased to 10% to 30% in the actual project), but increasing the derating margin will lead to an increase in the cost of the heat sink

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